Electronics Heating & Cooling Components
CATEGORIES
Price (Price shown excludes GST) | Description | Part Details |
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Heatsink, TO-218, TO-220, TO-247, 42 x 25 x 38.1mm, Vertical
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Arcol Ohmite Thermal Interface Pad, 0.5mm Thick, 3W/m·K, Silicone, 48.7x47.5mm
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Heatsink, For TGHE Series and SOT-227, 48.7 x 35.05 x 27.94mm, Panel
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Heatsink, TO-247, 23.1 x 16 x 35.6mm
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Heatsink, TO-218, TO-220, TO-247
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Heatsink, TO-218, TO-220, TO-247, 50.8 x 41.6 x 25mm, Vertical
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Heatsink, TO263, 12 x 25 x 10mm
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Heatsink, For TGHE Series and SOT-227, 48.7 x 55 x 30mm, Panel
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Heatsink, TO-220 and TO-247 Devices and Bridge Rectifiers, 16.28 x 16.3 x 25.4mm, PCB Through Hole
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Heatsink, BGA, CPU and GPU, 19 x 19 x 9mm, PCB Mount
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Heatsink, TO-252, TO-263 and TO-268, 12.7 x 35.31 x 11.68mm
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Heatsink, TO-252, TO-263 and TO-268, 12.7 x 40.13 x 11.68mm
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Heatsink, BGA, CPU and GPU, 32.5 x 32.5 x 7.5mm, PCB Mount
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Heatsink, 0.3°C/W, 254 x 248 x 58mm, Screw
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Heatsink, TO-252, TO-263 and TO-268, 12.7 x 40.13 x 11.68mm
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Heatsink, TO-218, TO-220, TO-247, 63.5 x 41.6 x 25mm, Vertical
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Heatsink, TO-247 and TO-264 Devices, 55 x 31 x 38mm, Vertical
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Arcol Ohmite Thermal Interface Pad, 0.5mm Thick, 3W/m·K, Silicone, 89.7x72.5mm
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Heatsink, IXYS I4 and CPC PAK, Ohmite CS10, TO-220, TO-247, 55 x 33.9 x 39.5mm
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Arcol Ohmite Thermal Interface Pad, 0.5mm Thick, 3W/m·K, Silicone, 65.2x47.5mm
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