Vishay SIHK Type N-Channel MOSFET, 30 A, 650 V Enhancement, 8-Pin PowerPAK 10 x 12 SIHK085N60EF-T1GE3

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Subtotal (1 reel of 2000 units)*

TWD313,400.00

(exc. GST)

TWD329,080.00

(inc. GST)

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Units
Per unit
Per Reel*
2000 +TWD156.70TWD313,400.00

*price indicative

RS Stock No.:
268-8306
Mfr. Part No.:
SIHK085N60EF-T1GE3
Manufacturer:
Vishay
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Brand

Vishay

Channel Type

Type N

Product Type

MOSFET

Maximum Continuous Drain Current Id

30A

Maximum Drain Source Voltage Vds

650V

Series

SIHK

Package Type

PowerPAK 10 x 12

Mount Type

PCB

Pin Count

8

Maximum Drain Source Resistance Rds

0.085Ω

Channel Mode

Enhancement

Forward Voltage Vf

1.2V

Typical Gate Charge Qg @ Vgs

63nC

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

184W

Maximum Operating Temperature

150°C

Length

9.9mm

Standards/Approvals

RoHS

Automotive Standard

No

COO (Country of Origin):
CN

Vishay SIHK Series MOSFET, 650V Maximum Drain Source Voltage, 30A Maximum Continuous Drain Current - SIHK085N60EF-T1GE3


This MOSFET is a high-voltage N-channel switching device designed for power conversion and control in industrial electronics. It operates as an enhancement-mode transistor suitable for PCB mounting and is intended for demanding applications that require robust thermal tolerance and substantial current handling.

Features and Benefits:


• 650V rating enables high-voltage switching capability • 30A continuous drain current supports heavy load duty • 0.085Ω Rds(on) reduces conduction losses at switching • 63nC typical gate charge allows predictable gate-drive design • 184W power dissipation permits significant heat throughput • 150°C maximum junction temperature supports high-temperature operation

Applications


• Suitable for high-voltage DC-DC converters in automation systems • Ideal for motor drive front-ends requiring high current headroom • Used for switch-mode power supplies in industrial electronics • Can be used for inverter stages in power control equipment

What gate-drive constraints should be considered for use?


The device tolerates gate voltages up to 30V and exhibits a typical total gate charge of 63nC, so drivers must supply sufficient charge and slew control within that voltage limit.

How should thermal management be arranged on the PCB?


With a maximum dissipation of 184W and high junction capability, provide substantial copper area, thermal vias and an appropriate heatsink attachment pattern to maintain safe operating temperatures.

What environmental temperature range will it tolerate during operation?


It operates down to -55°C and up to a maximum of 150°C, allowing deployment across broad ambient and elevated junction scenarios.

Which mounting approach is required for reliable assembly?


The part is intended for PCB mount in a PowerPAK 10x12 package with an 8-pin interface, so standard soldering processes for power packages should be used.

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