Infineon Isolated OptiMOS P 2 Type P-Channel MOSFET, 2 A, 30 V Enhancement, 6-Pin TSOP

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Subtotal (1 reel of 3000 units)*

TWD25,500.00

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TWD26,760.00

(inc. GST)

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3000 - 12000TWD8.50TWD25,500.00
15000 +TWD8.30TWD24,900.00

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RS Stock No.:
165-5552
Mfr. Part No.:
BSL308PEH6327XTSA1
Manufacturer:
Infineon
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Brand

Infineon

Channel Type

Type P

Product Type

MOSFET

Maximum Continuous Drain Current Id

2A

Maximum Drain Source Voltage Vds

30V

Series

OptiMOS P

Package Type

TSOP

Mount Type

Surface

Pin Count

6

Maximum Drain Source Resistance Rds

130mΩ

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

-5nC

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

500mW

Forward Voltage Vf

-0.8V

Transistor Configuration

Isolated

Maximum Operating Temperature

150°C

Height

1mm

Length

2.9mm

Standards/Approvals

No

Number of Elements per Chip

2

Automotive Standard

AEC-Q101

COO (Country of Origin):
CN

Infineon OptiMOS P Series MOSFET, 30V Drain Source Voltage, 2A Maximum Continuous Drain Current - BSL308PEH6327XTSA1


This MOSFET is a P‑channel enhancement transistor intended for surface‑mount applications in automotive and industrial electronics. It provides switched‑device functionality for high‑temperature environments and is delivered in a compact TSOP 6‑pin package with dual elements on a single chip, suitable for space‑constrained circuit assemblies.

Features and Benefits:


• Low on‑resistance of 130mΩ reduces conduction losses
• Rated for 30V drain‑source voltage enabling 30V system use
• Continuous drain current capability of 2A supports moderate loads
• Typical gate charge -5nC at Vgs for faster switching response
• Power dissipation 500mW allows reliable thermal handling
• Qualified to AEC‑Q101 for automotive stress performance

Applications


• Suitable for high‑temp automotive power switches
• Ideal for load‑switching in battery management systems
• Used with DC‑DC converters requiring P‑channel devices
• Can be used for dual‑channel polarity protection circuits
• Suitable for compact surface‑mount power distribution boards

What gate voltage limits should I observe for safe operation?


The gate‑to‑source voltage must not exceed 20V in either polarity to avoid device stress.

How many transistors are contained on the chip and what does that enable?


There are two P‑channel elements per chip, permitting paired switching or simplified dual‑channel layouts.

What ambient temperature range can the device withstand during operation?


It is specified for operation from -55°C up to 150°C for applications with elevated junction temperatures.

How does the package affect board placement and routing?


The TSOP 6‑pin surface package minimises board footprint and simplifies thermal and signal routing for compact designs.

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