Samtec ADM6 Series Vertical Surface PCB Header, 60 Contact(s), 635 μm Pitch, 4 Row, Shrouded
- RS Stock No.:
- 202-7907
- Mfr. Part No.:
- ADM6-60-01.5-L-4-2-A
- Manufacturer:
- Samtec
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Each
TWD822.00
(exc. GST)
TWD863.10
(inc. GST)
- RS Stock No.:
- 202-7907
- Mfr. Part No.:
- ADM6-60-01.5-L-4-2-A
- Manufacturer:
- Samtec
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Series | ADM6 | |
| Product Type | PCB Header | |
| Pitch | 635μm | |
| Current | 1.4 | |
| Housing Material | LCP | |
| Number of Contacts | 60 | |
| Number of Rows | 4 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Connector System | Board-to-Board | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -55°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | No | |
| Voltage | 155V ac | |
| Select all | ||
|---|---|---|
Brand Samtec | ||
Series ADM6 | ||
Product Type PCB Header | ||
Pitch 635μm | ||
Current 1.4 | ||
Housing Material LCP | ||
Number of Contacts 60 | ||
Number of Rows 4 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Connector System Board-to-Board | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Termination Type Solder | ||
Minimum Operating Temperature -55°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals No | ||
Voltage 155V ac | ||
- COO (Country of Origin):
- US
The Samtec Connector is a low profile, ultra-slim surface mount header. Delivering 56 Gbps PAM4 performance, the ADM6 is compatible with the UMPT and UMPS series to provide flexible, two-piece power/signal solutions.
Incredibly dense with up to 240 total I/Os
Low profile 5 mm stack height and slim 5 mm width
4-row design; 10 - 60 positions per row (40 - 240 total positions)
Edge Rate® contact system optimized for signal integrity performance
Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
Solder ball technology for simplified processing and self aligning
Additional stack heights and higher pin counts in development
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