Samtec ADM6 Series Vertical Surface PCB Header, 60 Contact(s), 0.635 mm Pitch, 4 Row, Shrouded
- RS Stock No.:
- 202-7907
- Mfr. Part No.:
- ADM6-60-01.5-L-4-2-A
- Manufacturer:
- Samtec
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Each
TWD822.00
(exc. GST)
TWD863.10
(inc. GST)
- RS Stock No.:
- 202-7907
- Mfr. Part No.:
- ADM6-60-01.5-L-4-2-A
- Manufacturer:
- Samtec
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Series | ADM6 | |
| Product Type | PCB Header | |
| Pitch | 0.635mm | |
| Current | 1.4 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 60 | |
| Number of Rows | 4 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Connector System | Board-to-Board | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | No | |
| Voltage | 155V ac | |
| Select all | ||
|---|---|---|
Brand Samtec | ||
Series ADM6 | ||
Product Type PCB Header | ||
Pitch 0.635mm | ||
Current 1.4 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 60 | ||
Number of Rows 4 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Connector System Board-to-Board | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Contact Gender Male | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals No | ||
Voltage 155V ac | ||
- COO (Country of Origin):
- US
The Samtec Connector is a low profile, ultra-slim surface mount header. Delivering 56 Gbps PAM4 performance, the ADM6 is compatible with the UMPT and UMPS series to provide flexible, two-piece power/signal solutions.
Incredibly dense with up to 240 total I/Os
Low profile 5 mm stack height and slim 5 mm width
4-row design; 10 - 60 positions per row (40 - 240 total positions)
Edge Rate® contact system optimized for signal integrity performance
Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
Solder ball technology for simplified processing and self aligning
Additional stack heights and higher pin counts in development
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