Samtec UDM6 Series Vertical Through Hole PCB Header, 12 Contact(s), 635 μm Pitch, 1 Row, Shrouded
- RS Stock No.:
- 644-468
- Mfr. Part No.:
- UDM6-10-2-01.5-L-A-TH-TR
- Manufacturer:
- Samtec
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- RS Stock No.:
- 644-468
- Mfr. Part No.:
- UDM6-10-2-01.5-L-A-TH-TR
- Manufacturer:
- Samtec
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Product Type | PCB Header | |
| Series | UDM6 | |
| Pitch | 635μm | |
| Current | 15A | |
| Number of Contacts | 12 | |
| Housing Material | LCP | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Contact Plating | Gold, Tin | |
| Contact Material | Copper Alloy | |
| Termination Type | Solder | |
| Row Pitch | 635μm | |
| Minimum Operating Temperature | -55°C | |
| Tail Pin Length | 1.5mm | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | PCIe 6.0/CXL 3.1 Capable, PCI Express, PCI-SIG | |
| Voltage | 283V | |
| Select all | ||
|---|---|---|
Brand Samtec | ||
Product Type PCB Header | ||
Series UDM6 | ||
Pitch 635μm | ||
Current 15A | ||
Number of Contacts 12 | ||
Housing Material LCP | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Contact Plating Gold, Tin | ||
Contact Material Copper Alloy | ||
Termination Type Solder | ||
Row Pitch 635μm | ||
Minimum Operating Temperature -55°C | ||
Tail Pin Length 1.5mm | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals PCIe 6.0/CXL 3.1 Capable, PCI Express, PCI-SIG | ||
Voltage 283V | ||
The Samtec 0.635 mm Socket is a AcceleRate mP high-density, high-speed power/signal socket which delivers industry leading performance with a compact 5 mm profile with 10 mm and 16 mm stack heights in development. It supports up to 8 power blades and 240 signal positions with higher counts coming soon, utilizes rotated power blades for enhanced cooling and simplified breakout routing, and features an open-pin-field design for routing and grounding flexibility. Engineered for high-speed applications, it delivers 64 Gbps PAM4 and is PCIe 6.0/CXL 3.1 capable, with alignment pins, polarized guide posts, and weld tabs included for secure mating and board retention.
Best in class density for power and signal
Rotated power blades improve performance and simplify breakout region
Open-pin-field design for routing and grounding flexibility
Polarized guide posts for blind mating
Optional alignment pins
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