Samtec UDM6 Series Vertical Through Hole PCB Header, 44 Contact(s), 635 μm Pitch, 1 Row, Shrouded
- RS Stock No.:
- 644-469
- Mfr. Part No.:
- UDM6-40-4-01.5-L-A-TH-TR
- Manufacturer:
- Samtec
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- RS Stock No.:
- 644-469
- Mfr. Part No.:
- UDM6-40-4-01.5-L-A-TH-TR
- Manufacturer:
- Samtec
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Series | UDM6 | |
| Product Type | PCB Header | |
| Current | 15A | |
| Pitch | 635μm | |
| Housing Material | LCP | |
| Number of Contacts | 44 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold, Tin | |
| Row Pitch | 635μm | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Tail Pin Length | 1.5mm | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | PCIe 6.0/CXL 3.1 Capable, PCI-SIG | |
| Select all | ||
|---|---|---|
Brand Samtec | ||
Series UDM6 | ||
Product Type PCB Header | ||
Current 15A | ||
Pitch 635μm | ||
Housing Material LCP | ||
Number of Contacts 44 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Contact Material Copper Alloy | ||
Contact Plating Gold, Tin | ||
Row Pitch 635μm | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Tail Pin Length 1.5mm | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals PCIe 6.0/CXL 3.1 Capable, PCI-SIG | ||
The Samtec 0.635 mm Socket is a AcceleRate mP high-density, high-speed power/signal socket which delivers industry leading performance with a compact 5 mm profile with 10 mm and 16 mm stack heights in development. It supports up to 8 power blades and 240 signal positions with higher counts coming soon, utilizes rotated power blades for enhanced cooling and simplified breakout routing, and features an open-pin-field design for routing and grounding flexibility. Engineered for high-speed applications, it delivers 64 Gbps PAM4 and is PCIe 6.0/CXL 3.1 capable, with alignment pins, polarized guide posts, and weld tabs included for secure mating and board retention.
Best in class density for power and signal
Rotated power blades improve performance and simplify breakout region
Open-pin-field design for routing and grounding flexibility
Polarized guide posts for blind mating
Optional alignment pins
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