Infineon SIPMOS Type N-Channel MOSFET, 110 mA, 240 V Enhancement, 3-Pin SOT-23 BSS131H6327XTSA1

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RS Stock No.:
165-5867
Mfr. Part No.:
BSS131H6327XTSA1
Manufacturer:
Infineon
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Brand

Infineon

Channel Type

Type N

Product Type

MOSFET

Maximum Continuous Drain Current Id

110mA

Maximum Drain Source Voltage Vds

240V

Series

SIPMOS

Package Type

SOT-23

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

20Ω

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

2.1nC

Minimum Operating Temperature

-55°C

Forward Voltage Vf

0.81V

Maximum Power Dissipation Pd

360mW

Maximum Operating Temperature

150°C

Height

1mm

Standards/Approvals

No

Length

2.9mm

Automotive Standard

AEC-Q101

COO (Country of Origin):
CN

Infineon SIPMOS Series MOSFET, 240V Maximum Drain Source Voltage, 110mA Maximum Continuous Drain Current - BSS131H6327XTSA1


This MOSFET is a high-voltage N-channel enhancement-mode transistor designed for surface-mount power switching in compact electronics. It operates across a wide temperature span suited to demanding environments and is intended for applications requiring controlled drain-source conduction with a moderate continuous current capability.

Features and Benefits:


• 240V drain-source rating enables high-voltage switching
• 110 mA continuous drain capability supports low-current loads
• 20V gate-source limit protects against excessive gate stress
• 20 Ω maximum RDS(on) simplifies thermal management at low currents
• 2.1 nC typical gate charge reduces drive energy requirements
• 360 mW power dissipation suits small form-factor thermal budgets

Applications


• Suitable for automotive sensor power switching
• Ideal for battery-management control circuitry
• Used for low-current motor-driver gate stages
• Can be used for level-shift and protection functions
• Used with handheld and portable instrumentation

What package and mounting method does it use for PCB assembly?


It is supplied in a SOT-23 package configured for surface-mount placement to suit automated soldering processes.

What environmental extremes can it withstand during operation?


The device is rated to operate from -55 °C up to 150 °C to accommodate wide thermal excursions.

How compact is the device for space-constrained designs?


The package footprint measures 2.9mm in length and 1.3mm in width while the component height is 1.0mm for tight-layout applications.

Does it meet any automotive qualification standard for vehicle use?


It conforms to the AEC‑Q101 automotive standard for semiconductor stress screening.

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