Infineon SIPMOS Type N-Channel MOSFET, 350 mA, 240 V Depletion, 4-Pin SOT-223 BSP129H6327XTSA1

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Subtotal (1 pack of 5 units)*

TWD175.00

(exc. GST)

TWD183.75

(inc. GST)

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  • 5 unit(s) shipping from August 14, 2026
  • Plus 1,000 unit(s) shipping from October 01, 2026
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5 +TWD35.00TWD175.00

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Packaging Options:
RS Stock No.:
753-2800
Mfr. Part No.:
BSP129H6327XTSA1
Manufacturer:
Infineon
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Brand

Infineon

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

350mA

Maximum Drain Source Voltage Vds

240V

Package Type

SOT-223

Series

SIPMOS

Mount Type

Surface

Pin Count

4

Maximum Drain Source Resistance Rds

20Ω

Channel Mode

Depletion

Maximum Power Dissipation Pd

1.8W

Typical Gate Charge Qg @ Vgs

3.8nC

Minimum Operating Temperature

-55°C

Forward Voltage Vf

1.2V

Maximum Operating Temperature

150°C

Height

1.6mm

Length

6.5mm

Standards/Approvals

No

Automotive Standard

AEC-Q101

Infineon SIPMOS Series MOSFET, 240V Maximum Drain Source Voltage, 350mA Maximum Continuous Drain Current - BSP129H6327XTSA1


This MOSFET is a high-voltage N-channel device designed for surface-mount power switching in demanding electronic systems. It operates across an extended ambient range and is suited to applications that require controlled conduction at elevated voltages while remaining compatible with SOT-223 mounting and automotive-grade expectations.

Features and Benefits:


• 240V drain rating enables high-voltage switching applications
• 350mA continuous drain current supports low-power loads
• 20Ω maximum Rds provides predictable on-state behaviour
• 3.8nC typical gate charge facilitates efficient switching
• 1.8W power dissipation allows moderate thermal loading
• 1.2V forward voltage ensures low voltage drop in conduction

Applications


• Used for high-voltage signal switching in automotive subsystems
• Suitable for low-current power rails and control circuitry
• Ideal for board-level power conditioning modules
• Used with thermal management on compact surface assemblies
• Can be used for battery-management peripheral functions

What gate drive constraints should I consider for switching?


The device accepts up to 20V between gate and source

design gate drivers to respect this limit and to provide adequate slew for the 3.8nC gate charge to balance switching speed and EMI.

How does temperature affect its electrical limits?


The component is specified to operate from -55°C to 150°C

designers must account for derating of power dissipation and junction-to-ambient thermal resistance when operating near the upper temperature bound.

What mounting considerations apply for thermal control?


The SOT-223 package is surface-mounted and benefits from PCB copper area for heat spreading

use a thermal pad or additional copper to maintain junction temperature under the 1.8W dissipation.

Are there specific pin-count constraints for layout?


The device presents four pins

ensure correct pad pattern and trace widths to handle the continuous drain current and to minimise parasitic resistance.

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