Infineon 4 V 130 mA Diode RF Mixer 3-Pin SOT-23 BAT1704E6327HTSA1
- RS Stock No.:
- 165-6745
- Mfr. Part No.:
- BAT1704E6327HTSA1
- Manufacturer:
- Infineon
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TWD9,300.00
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TWD9,780.00
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Units | Per unit | Per Reel* | Saving |
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- RS Stock No.:
- 165-6745
- Mfr. Part No.:
- BAT1704E6327HTSA1
- Manufacturer:
- Infineon
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Mount Type | Surface | |
| Product Type | Diode | |
| Package Type | SOT-23 | |
| Maximum Continuous Forward Current If | 130mA | |
| Peak Reverse Repetitive Voltage Vrrm | 4V | |
| Series | BAT17 | |
| Diode Configuration | Series | |
| Rectifier Type | RF Mixer | |
| Pin Count | 3 | |
| Peak Reverse Current Ir | 1.25μA | |
| Minimum Operating Temperature | -55°C | |
| Maximum Forward Voltage Vf | 600mV | |
| Maximum Operating Temperature | 125°C | |
| Width | 1.3mm | |
| Standards/Approvals | No | |
| Length | 2.9mm | |
| Height | 1mm | |
| Automotive Standard | AEC-Q101 | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Mount Type Surface | ||
Product Type Diode | ||
Package Type SOT-23 | ||
Maximum Continuous Forward Current If 130mA | ||
Peak Reverse Repetitive Voltage Vrrm 4V | ||
Series BAT17 | ||
Diode Configuration Series | ||
Rectifier Type RF Mixer | ||
Pin Count 3 | ||
Peak Reverse Current Ir 1.25μA | ||
Minimum Operating Temperature -55°C | ||
Maximum Forward Voltage Vf 600mV | ||
Maximum Operating Temperature 125°C | ||
Width 1.3mm | ||
Standards/Approvals No | ||
Length 2.9mm | ||
Height 1mm | ||
Automotive Standard AEC-Q101 | ||
- COO (Country of Origin):
- CN
Infineon BAT17 Series Diode, 130mA Max Continuous Forward Current, 4V Peak Reverse Repetitive Voltage - BAT1704E6327HTSA1
Features and Benefits:
• Handles 130 mA continuous forward current for stable operation
• Forward drop around 600 mV minimises signal distortion
• 4V reverse voltage rating protects against transient reversals
• Qualified to AEC-Q101 for automotive-grade reliability
Applications
• Ideal for automotive telematics and infotainment modules
• Used with compact surface-mount assemblies on dense boards
• Can be used for signal detection in RF front ends
What thermal range can the device tolerate during operation?
How does the package support manufacturing processes?
What electrical behaviour should be expected under reverse bias?
Is this component suitable for series diode configurations in signal paths?
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