Vishay 100 μF Surface Polymer Capacitor, 6.3V dc
- RS Stock No.:
- 173-0486
- Mfr. Part No.:
- T55B107M6R3C0035
- Manufacturer:
- Vishay
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Currently unavailable
We don't know if this item will be back in stock, RS intend to remove it from our range soon.
- RS Stock No.:
- 173-0486
- Mfr. Part No.:
- T55B107M6R3C0035
- Manufacturer:
- Vishay
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Vishay | |
| Technology | Polymer | |
| Product Type | Polymer Capacitor | |
| Capacitance | 100μF | |
| Voltage | 6.3V dc | |
| Mount Type | Surface | |
| Package/Case | 3528-21 | |
| Polarity | Polar | |
| Tolerance | ±20 % | |
| Maximum Operating Temperature | 105°C | |
| Dimensions | 3.5 x 2.8 x 1.9 mm | |
| Height | 1.9mm | |
| Depth | 2.8mm | |
| Length | 3.5mm | |
| Series | T55 | |
| Electrolyte Type | Solid | |
| Minimum Operating Temperature | -55°C | |
| Dissipation Factor | 10% | |
| Automotive Standard | No | |
| Ripple Current | 1.96A | |
| Leakage Current | 63μA | |
| Select all | ||
|---|---|---|
Brand Vishay | ||
Technology Polymer | ||
Product Type Polymer Capacitor | ||
Capacitance 100μF | ||
Voltage 6.3V dc | ||
Mount Type Surface | ||
Package/Case 3528-21 | ||
Polarity Polar | ||
Tolerance ±20 % | ||
Maximum Operating Temperature 105°C | ||
Dimensions 3.5 x 2.8 x 1.9 mm | ||
Height 1.9mm | ||
Depth 2.8mm | ||
Length 3.5mm | ||
Series T55 | ||
Electrolyte Type Solid | ||
Minimum Operating Temperature -55°C | ||
Dissipation Factor 10% | ||
Automotive Standard No | ||
Ripple Current 1.96A | ||
Leakage Current 63μA | ||
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
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