Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 2 Row, Shrouded

RS Stock No.:: 170-7044
Mfr. Part No.:: 43045-0400
Manufacturer:: Molex

Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 2 Row, Shrouded

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Subtotal (1 tray of 2232 units)*

TWD46,872.00

(exc. GST)

TWD49,215.60

(inc. GST)

FREE delivery for orders over NT$1,300.00

Temporarily out of stock

4,464 unit(s) shipping from June 12, 2026

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Units	Per unit	Per Tray*
2232 - 8928	TWD21.00	TWD46,872.00
11160 +	TWD20.60	TWD45,979.20

*price indicative

RS Stock No.:: 170-7044
Mfr. Part No.:: 43045-0400
Manufacturer:: Molex

Specifications

Product overview and Technical data sheets

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	Molex
	Series	Micro-Fit 3.0
	Product Type	PCB Header
	Pitch	3mm
	Current	5A
	Housing Material	Thermoplastic
	Number of Contacts	4
	Number of Rows	2
	Orientation	Right Angle
	Shrouded/Unshrouded	Shrouded
	Mount Type	Through Hole
	Connector System	Wire-to-Board
	Contact Plating	Tin
	Contact Material	Brass
	Row Pitch	3mm
	Minimum Operating Temperature	-40°C
	Termination Type	Solder
	Maximum Operating Temperature	105°C
	Contact Gender	Male
	Mating Pin Length	3mm
	Standards/Approvals	No
	Voltage	250V

	Select all
	Brand Molex
	Series Micro-Fit 3.0
	Product Type PCB Header
	Pitch 3mm
	Current 5A
	Housing Material Thermoplastic
	Number of Contacts 4
	Number of Rows 2
	Orientation Right Angle
	Shrouded/Unshrouded Shrouded
	Mount Type Through Hole
	Connector System Wire-to-Board
	Contact Plating Tin
	Contact Material Brass
	Row Pitch 3mm
	Minimum Operating Temperature -40°C
	Termination Type Solder
	Maximum Operating Temperature 105°C
	Contact Gender Male
	Mating Pin Length 3mm
	Standards/Approvals No
	Voltage 250V

COO (Country of Origin):: MX

Molex Right Angle PCB Header, 4 Way, 2 Rows - Micro-Fit 3.0 Series - 43045-0400

This header from Molex's Micro-Fit 3.0 series has a right-angled orientation to save space on your PCB (printed circuit board) and reduce strain on cables. It's a reliable and compact 4-way header with a 3.0mm pitch and is used in low-range to mid-range power distribution. The housing is made from a high-temperature liquid crystal polymer that's able to handle the high temperatures (up to +265°C) that occur during the infra-red reflow soldering process. The contacts are fully isolated inside the housing to reduce arcing.

Features & Benefits

• Locking ramps on the housing offer positive latching to prevent accidental disconnection

• Tin-plated contacts resist corrosion to ensure excellent conductivity and reliable data transfer

• Plastic peg PCB locks make a secure connection to the PCB

• Through-hole mounting and solder termination make a strong connection with the board

Applications

• Data communications

• Solar power installations

• Gaming terminals

What's the Molex Micro-Fit system?

Molex's Micro-Fit system is a compact and versatile series of connectors available in multiple circuit sizes and cable lengths. These components are used for board-to-board, wire-to-board and wire-to-wire configurations.

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

Features and Benefits

• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Through hole versions SMT compatible

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Plastic peg PCB locks for secure connection to PCB

• Glow Wire Compliant

Product Application Information

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals