Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 1 Row, Shrouded

RS Stock No.:: 161-7955
Mfr. Part No.:: 43650-0400
Manufacturer:: Molex

Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 1 Row, Shrouded

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TWD77,112.00

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TWD80,967.60

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2380 - 9520	TWD32.40	TWD77,112.00	-
11900 +	TWD31.40	TWD74,732.00	TWD11,900.00

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RS Stock No.:: 161-7955
Mfr. Part No.:: 43650-0400
Manufacturer:: Molex

Specifications

Product overview and Technical data sheets

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	Molex
	Series	Micro-Fit 3.0
	Product Type	PCB Header
	Pitch	3mm
	Current	8.5
	Housing Material	TPE
	Number of Contacts	4
	Number of Rows	1
	Orientation	Right Angle
	Shrouded/Unshrouded	Shrouded
	Mount Type	Through Hole
	Connector System	Wire-to-Board
	Contact Material	Brass
	Contact Plating	Tin
	Termination Type	Solder
	Row Pitch	3mm
	Minimum Operating Temperature	-40°C
	Maximum Operating Temperature	105°C
	Contact Gender	Male
	Standards/Approvals	No
	Voltage	600V

	Select all
	Brand Molex
	Series Micro-Fit 3.0
	Product Type PCB Header
	Pitch 3mm
	Current 8.5
	Housing Material TPE
	Number of Contacts 4
	Number of Rows 1
	Orientation Right Angle
	Shrouded/Unshrouded Shrouded
	Mount Type Through Hole
	Connector System Wire-to-Board
	Contact Material Brass
	Contact Plating Tin
	Termination Type Solder
	Row Pitch 3mm
	Minimum Operating Temperature -40°C
	Maximum Operating Temperature 105°C
	Contact Gender Male
	Standards/Approvals No
	Voltage 600V

Molex Micro-Fit 3.0 Series PCB Header, 3mm Pitch, 4 Contacts - 43650-0400

This PCB header is specifically designed for efficient wire-to-board connections. It features a right-angle orientation and comes equipped with four circuits to accommodate various electrical needs. The shrouded design enhances security against accidental disengagement, making it suitable for automated applications in the electrical and mechanical industries.

Features & Benefits

• Compatible with surface mount applications for versatile integration

• Shrouded design prevents misalignment during connection

• High-temperature thermoplastic ensures durability under extreme conditions

• Supports up to 8.5A current rating for reliable performance

• Through-hole termination method simplifies installation process

• Glow wire compliant for enhanced safety in high-heat environments

Applications

• Ideal for power distribution in electronic devices

• Suitable for connections in automation equipment

• Utilised in consumer electronics for reliable power transfer

• Employed in control systems requiring robust interconnection

What is the recommended PCB thickness for optimal performance?

The ideal PCB thickness for this connector is 1.60mm, ensuring secure mounting and electrical reliability.

How does the shrouded design benefit connectivity?

The shrouded design enhances the connector's stability, reducing the risk of misalignment and ensuring a secure fit during operation.

What type of solder process can be used with this header?

It can be used in both SMC and wave solder processes, allowing for flexibility during assembly.

What operating temperature range can this connector withstand?

It is capable of operating within a temperature range of -40°C to +105°C, making it suitable for various environments.

What materials are used for contact plating and why is it important?

The contacts are plated with tin, which provides good conductivity and resistance to corrosion, ensuring long-lasting performance in demanding applications.

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with Snap in Plastic Peg PCB Lock, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

Features and Benefits

• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Through hole versions SMT compatible

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Plastic peg PCB locks for secure connection to PCB

• Glow Wire Compliant

Product Application Information

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals