Infineon HEXFET Type N-Channel MOSFET, 1.2 A, 60 V Enhancement, 3-Pin SOT-23 IRLML2060TRPBF

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TWD192.00

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TWD201.60

(inc. GST)

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20 - 740TWD9.60TWD192.00
760 - 1480TWD9.40TWD188.00
1500 +TWD8.70TWD174.00

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Packaging Options:
RS Stock No.:
725-9357
Distrelec Article No.:
304-45-313
Mfr. Part No.:
IRLML2060TRPBF
Manufacturer:
Infineon
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Brand

Infineon

Channel Type

Type N

Product Type

MOSFET

Maximum Continuous Drain Current Id

1.2A

Maximum Drain Source Voltage Vds

60V

Package Type

SOT-23

Series

HEXFET

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

480mΩ

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

0.67nC

Forward Voltage Vf

1.2V

Maximum Power Dissipation Pd

1.25W

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

150°C

Height

1.02mm

Standards/Approvals

No

Length

3.04mm

Automotive Standard

No

Infineon HEXFET Series MOSFET, 60V Maximum Drain Source Voltage, 1.2A Maximum Continuous Drain Current - IRLML2060TRPBF


This MOSFET is a compact N-channel enhancement device intended for low-power switching in surface-mounted circuits. It offers moderate voltage handling and continuous current capacity for use in portable and space-constrained electronic assemblies, operating reliably across an extended temperature range.

Features and Benefits:


• Low Rds(on) of 480mΩ enables reduced conduction losses
• Maximum Vds 60V allows medium-voltage switching applications
• Continuous drain current 1.2A supports modest load currents
• Gate charge Qg 0.67nC enables faster gate-drive transitions
• Power dissipation rating 1.25W limits thermal rise under load
• Gate-source withstand 16V gives margin for drive variation

Applications


• Suitable for DC switch control in battery-powered devices
• Ideal for small motor-driver circuits and load switching
• Used with logic-level drivers for efficient power conversion
• Can be used for signal-level power distribution on PCBs
• Suitable for compact power-management modules in instrumentation

What temperature conditions can it withstand during operation?


It is specified to function down to -55°C and up to 150°C for use in environments with wide thermal variation.

How does the package affect board layout and assembly?


The SOT-23 surface-mount package minimises board footprint and eases automated placement for high-density assemblies.

What electrical stress limits should designers consider for gate drive?


The maximum gate-source voltage is 16V, so gate drivers should remain within this value to avoid over-stressing the gate.

How does its switching behaviour impact thermal management?


With a typical gate charge of 0.67nC and 1.25W power dissipation, duty cycle and switching frequency must be managed to prevent excessive junction heating.

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