Infineon FS1150R08A8P3LBCHPSA1, N-Channel Half Bridge IGBT, 1.15 kA 750 V AQG-324, Screw
- RS Stock No.:
- 349-028
- Mfr. Part No.:
- FS1150R08A8P3LBCHPSA1
- Manufacturer:
- Infineon
Subtotal (1 unit)*
TWD38,481.00
(exc. GST)
TWD40,405.05
(inc. GST)
Stock information currently inaccessible - Please check back later
Units | Per unit |
|---|---|
| 1 + | TWD38,481.00 |
*price indicative
- RS Stock No.:
- 349-028
- Mfr. Part No.:
- FS1150R08A8P3LBCHPSA1
- Manufacturer:
- Infineon
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Maximum Continuous Collector Current Ic | 1.15kA | |
| Product Type | IGBT | |
| Maximum Collector Emitter Voltage Vceo | 750V | |
| Number of Transistors | 6 | |
| Maximum Power Dissipation Pd | 10000W | |
| Configuration | Half Bridge | |
| Package Type | AQG-324 | |
| Mount Type | Screw | |
| Channel Type | N | |
| Maximum Collector Emitter Saturation Voltage VceSAT | 1.09V | |
| Maximum Gate Emitter Voltage VGEO | ±20 V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | RoHS, UL 94 V0 | |
| Automotive Standard | AQG 324 | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Maximum Continuous Collector Current Ic 1.15kA | ||
Product Type IGBT | ||
Maximum Collector Emitter Voltage Vceo 750V | ||
Number of Transistors 6 | ||
Maximum Power Dissipation Pd 10000W | ||
Configuration Half Bridge | ||
Package Type AQG-324 | ||
Mount Type Screw | ||
Channel Type N | ||
Maximum Collector Emitter Saturation Voltage VceSAT 1.09V | ||
Maximum Gate Emitter Voltage VGEO ±20 V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals RoHS, UL 94 V0 | ||
Automotive Standard AQG 324 | ||
- COO (Country of Origin):
- DE
The Infineon HybridPACK Drive G2 module is a very compact six pack power module with enhanced package optimized for hybrid and electric vehicles. The power module implements Infineons next generation chip technology EDT3 750V, optimized for electric drive train applications, from mid to high range automotive power classes.
Low inductive design
4.2 kV DC 1 second insulation
High creepage and clearance distances
Direct cooled PinFin base plate
PCB and cooler assembly guidelines
PressFIT contact technology
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