Winslow Straight Through Hole Mount 1.27 mm Pitch IC Socket Adapter, PLCC to PGA
- RS Stock No.:
- 741-9350
- Mfr. Part No.:
- WA084127DAJTRC
- Manufacturer:
- Winslow
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Bulk discount available
Subtotal (1 unit)*
TWD1,268.00
(exc. GST)
TWD1,331.40
(inc. GST)
Add 2 units to get free delivery
In Stock
- Plus 134 unit(s) shipping from February 16, 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 - 24 | TWD1,268.00 |
| 25 - 99 | TWD1,217.00 |
| 100 + | TWD1,166.00 |
*price indicative
- RS Stock No.:
- 741-9350
- Mfr. Part No.:
- WA084127DAJTRC
- Manufacturer:
- Winslow
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Product Type | IC Socket Adapter | |
| Connection A | PLCC | |
| Connection Gender A | Female | |
| Number of Contacts A | 84 | |
| Number of Contacts B | 84 | |
| Connection Gender B | Male | |
| Connection B | PGA | |
| Pitch | 1.27mm | |
| Contact Plating | Tin over Nickel | |
| Mount Type | Through Hole | |
| Orientation | Straight | |
| Standards/Approvals | No | |
| Contact Material | Brass | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Product Type IC Socket Adapter | ||
Connection A PLCC | ||
Connection Gender A Female | ||
Number of Contacts A 84 | ||
Number of Contacts B 84 | ||
Connection Gender B Male | ||
Connection B PGA | ||
Pitch 1.27mm | ||
Contact Plating Tin over Nickel | ||
Mount Type Through Hole | ||
Orientation Straight | ||
Standards/Approvals No | ||
Contact Material Brass | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
PLCC Pads to PGA Pin Adapters
These Winslow Adaptics PLCC with Pads to PGA Pin Adapters have a 1.6mm above board height.
IC Sockets-Package Adaptics
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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