Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter, PLCC to PGA
- RS Stock No.:
- 741-9335
- Mfr. Part No.:
- WA032127DAJTRC
- Manufacturer:
- Winslow
The image is for reference only, please refer to product details and specifications
Bulk discount available
Subtotal (1 unit)*
TWD332.00
(exc. GST)
TWD348.60
(inc. GST)
Add 4 units to get free delivery
Temporarily out of stock
- Shipping from April 14, 2026
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Units | Per unit |
|---|---|
| 1 - 24 | TWD332.00 |
| 25 - 99 | TWD319.00 |
| 100 + | TWD305.00 |
*price indicative
- RS Stock No.:
- 741-9335
- Mfr. Part No.:
- WA032127DAJTRC
- Manufacturer:
- Winslow
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Product Type | IC Socket Adapter | |
| Connection A | PLCC | |
| Number of Contacts A | 32 | |
| Connection Gender A | Female | |
| Connection Gender B | Male | |
| Number of Contacts B | 32 | |
| Pitch | 2.54mm | |
| Connection B | PGA | |
| Series | WAxx127DAJT / WAxx127DSAJT | |
| Contact Plating | Tin over Nickel | |
| Mount Type | Through Hole | |
| Orientation | Straight | |
| Standards/Approvals | No | |
| Contact Material | Brass | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Product Type IC Socket Adapter | ||
Connection A PLCC | ||
Number of Contacts A 32 | ||
Connection Gender A Female | ||
Connection Gender B Male | ||
Number of Contacts B 32 | ||
Pitch 2.54mm | ||
Connection B PGA | ||
Series WAxx127DAJT / WAxx127DSAJT | ||
Contact Plating Tin over Nickel | ||
Mount Type Through Hole | ||
Orientation Straight | ||
Standards/Approvals No | ||
Contact Material Brass | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
PLCC Pads to PGA Pin Adapters
These Winslow Adaptics PLCC with Pads to PGA Pin Adapters have a 1.6mm above board height.
IC Sockets-Package Adaptics
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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