SPREADFAST Heatsink, Universal Square Ceramic 2.5 mm 25 mm 25mm
- RS Stock No.:
- 123-5623
- Mfr. Part No.:
- SF-CHS-252503F
- Manufacturer:
- SPREADFAST
Bulk discount available
View bulk pricing optionsSubtotal (5 units, in packs of 5)*
TWD148.00
(exc. GST)
TWD155.40
(inc. GST)
FREE delivery for orders over NT$1,300.00
In Stock
- 620 unit(s) ready to ship from another location
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Pack* |
|---|---|---|
| 5 - 120 | TWD29.60 | TWD148.00 |
| 125 - 245 | TWD28.80 | TWD144.00 |
| 250 - 495 | TWD28.00 | TWD140.00 |
| 500 + | TWD27.60 | TWD138.00 |
*price indicative
- RS Stock No.:
- 123-5623
- Mfr. Part No.:
- SF-CHS-252503F
- Manufacturer:
- SPREADFAST
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | SPREADFAST | |
| Product Type | Heatsink | |
| For Use With | Universal Square Ceramic | |
| Length | 25mm | |
| Width | 25mm | |
| Height | 2.5mm | |
| Thermal Resistance | 45.4°C/W | |
| Fastening | Adhesive, Screw | |
| Series | Finned | |
| Colour | White | |
| Standards/Approvals | RoHS | |
| Material | Ceramic | |
| Select all | ||
|---|---|---|
Brand SPREADFAST | ||
Product Type Heatsink | ||
For Use With Universal Square Ceramic | ||
Length 25mm | ||
Width 25mm | ||
Height 2.5mm | ||
Thermal Resistance 45.4°C/W | ||
Fastening Adhesive, Screw | ||
Series Finned | ||
Colour White | ||
Standards/Approvals RoHS | ||
Material Ceramic | ||
- COO (Country of Origin):
- CN
Spreadfast SF-CHS Series Finned Ceramic Heatsink
Spreadfast SF-CHS series of finned ceramic heatsinks have been designed as a lower density improvement over traditional metal heatsinks. The innate characteristics of ceramic heatsinks means the SF-CHS series have a high breakdown voltage and heat dissipation. Thanks to the meticulous design of these ceramic heatsinks, the SF-CHS series are ideally suited to applications where thermal cycling stability are required.
Typical Applications
Traditional heatsink replacement.
LED & chipset cooling.
Power modules.
IC cooling.
Ceramic Heatsinks
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