SPREADFAST Heatsink, Universal Square Ceramic, 21.3 °C/W @ 100 lfm, 9.8 °C/W @ 400 lfm, 21 x 21 x 10mm, Adhesive, Screw
- RS Stock No.:
- 123-5632
- Mfr. Part No.:
- SF-CHS-212110-PC
- Manufacturer:
- SPREADFAST
Bulk discount available
Subtotal (1 pack of 5 units)**
Was TWD1,205.00
You pay
TWD171.00
(exc. GST)
TWD179.55
(inc. GST)
375 In stock for delivery within 6 working days*
* Delivery dates may change based on your chosen quantity and delivery address.
FREE delivery for orders over TWD2,857.00 (ex VAT)
Units | Per unit | Per Pack** |
|---|---|---|
| 5 - 120 | TWD34.20 | TWD171.00 |
| 125 - 245 | TWD33.00 | TWD165.00 |
| 250 - 495 | TWD31.60 | TWD158.00 |
| 500 + | TWD30.80 | TWD154.00 |
**price indicative
- RS Stock No.:
- 123-5632
- Mfr. Part No.:
- SF-CHS-212110-PC
- Manufacturer:
- SPREADFAST
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Manufacturer | SPREADFAST | |
| For Use With | Universal Square Ceramic | |
| Length | 21mm | |
| Width | 21mm | |
| Height | 10mm | |
| Dimensions | 21 x 21 x 10mm | |
| Thermal Resistance | 21.3 °C/W @ 100 lfm, 9.8 °C/W @ 400 lfm | |
| Mounting | Adhesive, Screw | |
| Series | Pin Fin | |
| Colour | White | |
| Material | Ceramic | |
| Application | Chipset, Cooling, IC Cooling, LED, Metal Heat Sink Replacement, Power Modules | |
| Special Features | Lower Density, High Breakdown Voltage, Good Heat Spreader, High Volume Resistivity, Good EMC, Ideal for Direct Metalisation, Good Thermal Cycling Stability | |
Select all | ||
|---|---|---|
Manufacturer SPREADFAST | ||
For Use With Universal Square Ceramic | ||
Length 21mm | ||
Width 21mm | ||
Height 10mm | ||
Dimensions 21 x 21 x 10mm | ||
Thermal Resistance 21.3 °C/W @ 100 lfm, 9.8 °C/W @ 400 lfm | ||
Mounting Adhesive, Screw | ||
Series Pin Fin | ||
Colour White | ||
Material Ceramic | ||
Application Chipset, Cooling, IC Cooling, LED, Metal Heat Sink Replacement, Power Modules | ||
Special Features Lower Density, High Breakdown Voltage, Good Heat Spreader, High Volume Resistivity, Good EMC, Ideal for Direct Metalisation, Good Thermal Cycling Stability | ||