Bopla BoLink Series Seal for Use with BoPad 10.1 Enclosures, 291 x 204 x 54.3mm
- RS Stock No.:
- 200-5496
- Mfr. Part No.:
- 35310101 BOP 10.1 S
- Manufacturer:
- Bopla
Temporarily out of stock - back order for despatch 03/07/2024, delivery within 6 working days
Added
Price (VAT excluded) Each
TWD915.00
(exc. GST)
TWD960.75
(inc. GST)
| Units | Per unit |
| 1 - 9 | TWD915.00 |
| 10 - 24 | TWD877.00 |
| 25 + | TWD859.00 |
- RS Stock No.:
- 200-5496
- Mfr. Part No.:
- 35310101 BOP 10.1 S
- Manufacturer:
- Bopla
Product overview and Technical data sheets
Legislation and Compliance
Product Details
The Bopla BoLink IoT Enclosure is a sensor enclosure which is made of polycarbonate material. It is a very intelligent and versatile enclosure system for modern IoT sensor technology. The enclosure is available in three variants without wall brackets, with wall brackets, with wall brackets and lid fixing on top. The PC material is suitable for outdoor use due to f1-listing according to UL 746C.
IP65 rating
UL 94 V0 Fire class
Design seal optional
UL 94 V0 Fire class
Design seal optional
Specifications
Attribute | Value |
|---|---|
| Type | Seal |
| Length | 291mm |
| For Use With | BoPad 10.1 Enclosures |
| Width | 204mm |
| Dimensions | 291 x 204 x 54.3mm |
| Height | 54mm |
| Series | BoLink |