Potting Compounds

What is it?Used in electronics potting is a process off filling a complete assembly with a solid or gelatinous compound for resistance to shock and vibration, and for exclusion of moisture and corrosive agents. Thermosetting plastics or silicone rubber gels are often used.Types of compounds:Epoxy Potting Compounds - Epoxy potting compounds generally have better adhesion, high temperature resistance, and chemical resistance. Epoxy systems have better adhesion to a wide variety of substrates and typically do not need primers. They are easy to use and are predicable. They have good high temperature resistance up to 400°FUrethane Potting Compounds - Urethane potting compounds generally have better flexibility, elongation, and abrasion resistance. Since they can have Tg below -40°C they are a good selection for SMT PC board potting. Their gel time can be easily changed with an accelerator without changing the propertiesSilicone Potting Compounds - Silicone potting compounds and encapsulating materials are also soft, flexible, and have better elongation. Silicone materials also provide the widest operating temperatures. Specially formulated silicone potting compounds can operate at below -100°C and most silicone materials can handle 200°C temperatures. Acrylic Potting Compounds - Acrylic potting compounds are UV and heat hardening materials, Very fast hardening, adequate chemical resistance and clear in appearance

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Description Price Trade Name Product Material Package Type Package Size Special Properties Cure Time Hardness Thermal Conductivity Colour Maximum Operating Temperature Minimum Operating Temperature Chemical Composition Dielectric Strength Odour
RS Stock No. 146-6593
- PUR Pack 250 g Chemical Resistance, Mark Resistance, Scratch Resistance, UV Light Resistance, Weather Resistance, Yellowing Resistance 4 h @ 60 °C, 24 h @ 23 °C 75 Shore A 0.2W/mK Clear +120°C -40°C Polyurethane Resin 11kV/mm -