Cypress Semiconductor CYUSB3304-68LTXI, USB Controller, 4-Channel, 68-Pin QFN

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Subtotal 65 units (supplied in a tray)*

TWD18,720.00

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TWD19,656.00

(inc. GST)

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65 - 129TWD288.00
130 +TWD283.00

*price indicative

Packaging Options:
RS Stock No.:
182-0327P
Mfr. Part No.:
CYUSB3304-68LTXI
Manufacturer:
Cypress Semiconductor
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Brand

Cypress Semiconductor

Number of Transceivers

4

Product Type

USB Controller

Power Supply Type

Single

ESD Protection

Yes

Mount Type

Surface

Package Type

QFN

Pin Count

68

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

85°C

Width

8mm

Height

950μm

Length

8mm

Infineon USB Controller, 68 Pins, Surface Mount Type - CYUSB3304-68LTXI


This USB controller is a compact Infineon device designed to manage multiple USB transceivers within embedded systems. It operates from a single power rail and is intended for surface-mounted integration where board space and vertical profile are constrained. The component includes electrostatic discharge safeguarding and is specified for extended temperature environments common in mobile and automotive-adjacent electronics.

Features and Benefits:


• Four transceivers enabling multi-channel USB connectivity
• Single-supply operation simplifying power-rail design
• ESD protection reducing risk from electrostatic events
• Surface-mount QFN package for automated assembly
• Broad temperature range supporting harsh environments
• Low-profile package aiding slim system designs

Applications


• Suitable for multi-port USB hubs in compact devices
• Ideal for in-vehicle infotainment interface modules
• Used with industrial controllers requiring robust I/O
• Can be used for portable electronics with limited height
• Appropriate for automotive-adjacent sensor communication systems

What pin count should I plan for on the PCB footprint?


The device uses a 68-pin layout, so the board footprint and routing must accommodate that pin count.

How does the package influence thermal management on the PCB?


The QFN format provides a short thermal path to the board

designers should include thermal vias and copper pours beneath the package to aid heat dissipation.

What assembly considerations are important for this component?


As a surface-mount QFN, it requires precise solder paste deposition and reflow profiles suitable for low-profile packages to ensure reliable joints.

Which environmental range can the device handle during operation?


It is rated to function from -40°C up to 85°C, covering a wide span of operating conditions.

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