Bergquist TSP 1800 Series Self-Adhesive Thermal Interface Pad, 0.009in Thick, 1.8W/m·K, Silicone, 12 x 12 x 0.009in

The Bergquist silicone based fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient re-positioning and ease of use as well as an optional adhesive coating. It exhibits exceptional thermal performance at low and high application pressures. The material is ideal for placement between electronic power devices and a heat sink for screw and clip mounted applications.

Exceptional thermal performance at lower application pressures
Smooth and non-tacky on both sides for easy re-positioning, ease of use and assembly error reduction
Superior breakdown voltage and surface wet out values
Designed for applications where