Bergquist 3500ULM Series Self-Adhesive Thermal Interface Pad, 0.508 → 3.175mm Thick, 3.5W/m·K, Silicone
- RS Stock No.:
- 282-6851
- Mfr. Part No.:
- PAD TGP 3500ULMG
- Manufacturer:
- Bergquist
Temporarily out of stock - back order for despatch 16/07/2024, delivery within 6 working days
Added
Price (VAT excluded) Each
TWD8,314.00
(exc. GST)
TWD8,729.70
(inc. GST)
| Units | Per unit |
| 1 + | TWD8,314.00 |
- RS Stock No.:
- 282-6851
- Mfr. Part No.:
- PAD TGP 3500ULMG
- Manufacturer:
- Bergquist
Product overview and Technical data sheets
Legislation and Compliance
RoHS Status: Not Applicable
- COO (Country of Origin):
- US
Product Details
The Bergquist n extremely soft gap filling material with a thermal conductivity of 3.5 W per m K. The material offers exceptional thermal performance at low pressures due to a unique 3.5 W per m K filler package and ultra-low modulus resin formulation. The enhanced material is well suited for high performance applications requiring extremely low assembly stress. It maintains a conformable nature that allows for excellent interfacing and wet out characteristics, even to surfaces with high roughness.
Fiberglass reinforced for shear and tear resistance
Non-fiberglass option for applications that require an additional reduction in stress
Non-fiberglass option for applications that require an additional reduction in stress
Specifications
Attribute | Value |
|---|---|
| Thickness | 0.508 → 3.175mm |
| Thermal Conductivity | 3.5W/m·K |
| Material | Silicone |
| Self-Adhesive | Yes |
| Series | 3500ULM |