Bergquist HC3000 Series Self-Adhesive Thermal Gap Pad, 0.01in Thick, 3W/m·K, Silicone, 16 x 8 x 0.01in
- RS Stock No.:
- 282-6819
- Mfr. Part No.:
- GAP PAD TGP HC3000, 16in x 8in x 0.01 sh
- Manufacturer:
- Bergquist
Temporarily out of stock - back order for despatch 16/07/2024, delivery within 6 working days
Added
Price (VAT excluded) Each
TWD1,355.00
(exc. GST)
TWD1,422.75
(inc. GST)
| Units | Per unit |
| 1 + | TWD1,355.00 |
- RS Stock No.:
- 282-6819
- Mfr. Part No.:
- GAP PAD TGP HC3000, 16in x 8in x 0.01 sh
- Manufacturer:
- Bergquist
Product overview and Technical data sheets
Legislation and Compliance
RoHS Status: Not Applicable
- COO (Country of Origin):
- US
Product Details
The Bergquist is a soft and compliant gap filling material with a thermal conductivity of 3.0 W per m K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly.
High-compliance
Low compression stress
Fiberglass reinforced for shear and tear resistance
Low compression stress
Fiberglass reinforced for shear and tear resistance
Specifications
Attribute | Value |
|---|---|
| Dimensions | 16 x 8 x 0.01in |
| Thickness | 0.01in |
| Length | 16in |
| Width | 8in |
| Thermal Conductivity | 3W/m·K |
| Material | Silicone |
| Self-Adhesive | Yes |
| Series | HC3000 |