STMicroelectronics VL53L1 nucleo pack with X-NUCLEO-53L1A2 expansion board and STM32F401RE nucleo board Proximity Sensor
- RS Stock No.:
- 206-6056
- Mfr. Part No.:
- P-NUCLEO-53L1A2
- Manufacturer:
- STMicroelectronics
Bulk discount available
Subtotal (1 unit)*
TWD2,190.00
(exc. GST)
TWD2,299.50
(inc. GST)
FREE delivery for orders over NT$1,300.00
Supply shortage
- Plus 12 left, shipping from December 15, 2025
Our current stock is limited and our suppliers are expecting shortages.
Units | Per unit |
|---|---|
| 1 - 4 | TWD2,190.00 |
| 5 + | TWD2,146.00 |
*price indicative
- RS Stock No.:
- 206-6056
- Mfr. Part No.:
- P-NUCLEO-53L1A2
- Manufacturer:
- STMicroelectronics
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | STMicroelectronics | |
| Product Type | Sensor Development Tool | |
| Sensor Technology | Proximity | |
| Featured Device | VL53L1 | |
| For Use With | VL53VL1 | |
| Kit Classification | Sensor Board | |
| Kit Name | VL53L1 nucleo pack with X-NUCLEO-53L1A2 expansion board and STM32F401RE nucleo board | |
| Standards/Approvals | RoHS | |
| Select all | ||
|---|---|---|
Brand STMicroelectronics | ||
Product Type Sensor Development Tool | ||
Sensor Technology Proximity | ||
Featured Device VL53L1 | ||
For Use With VL53VL1 | ||
Kit Classification Sensor Board | ||
Kit Name VL53L1 nucleo pack with X-NUCLEO-53L1A2 expansion board and STM32F401RE nucleo board | ||
Standards/Approvals RoHS | ||
The STMicroelectronics P-NUCLEO-53L1A2 is a complete evaluation kit which allows anyone to learn, evaluate, and develop their application using the VL53L1 ToF, ranging sensor with multi object detection and FoV programming.
X-NUCLEO-53L1A2 expansion board including the VL53L1 ToF (Time-of-Flight)
ranging sensor with multi object detection and FoV (field of view) programming
STM32F401RE nucleo board
Two VL53L1 breakout boards
0.25, 0.5 and 1 mm spacers to simulate air gaps between ToF sensor and cover window