Infineon Low Side 8, Low Side Power Switch IC 36-Pin, DSO-36

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Subtotal (1 reel of 1000 units)*

TWD189,500.00

(exc. GST)

TWD198,980.00

(inc. GST)

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  • Shipping from June 23, 2027
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Units
Per unit
Per Reel*
1000 - 4000TWD189.50TWD189,500.00
5000 +TWD183.80TWD183,800.00

*price indicative

RS Stock No.:
229-1910
Mfr. Part No.:
TLE8110EDXUMA1
Manufacturer:
Infineon
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Brand

Infineon

Power Switch Type

Low Side

Power Switch Topology

Low Side

Product Type

Power Switch IC

Switch On Resistance RdsOn

1.2nΩ

Number of Outputs

10

Number of Inputs

8

Interface Type

Parallel, SPI

Mount Type

Surface

Minimum Supply Voltage

3V

Package Type

DSO-36

Maximum Supply Voltage

5.5V

Pin Count

36

Maximum Operating Temperature

150°C

Minimum Operating Temperature

-40°C

Operating Current

0.002A

Height

2.5mm

Width

10.3mm

Length

10.3mm

Standards/Approvals

No

Series

TLE8110ED

Automotive Standard

AEC

Infineon TLE8110ED Series Power Switch IC, 5.5V Maximum Supply Voltage, 10 Outputs - TLE8110EDXUMA1


This power switch IC is a low-side automotive switching device designed for control of multiple loads in vehicles. It operates within automotive voltage levels and is intended for surface-mounted installations where parallel or serial peripheral Interface control is required. The component is developed to function across extended temperature conditions typical of automotive environments.

Features and Benefits:


• Low-side topology delivers controlled switching for ground-side loads
• Operates from 3 V to 5.5 V for compatibility with common vehicle rails
• Ten outputs enable Compact multi-load management in one package
• Eight inputs provide flexible control signals for complex systems
• Very low Rds(on) of 1.2 nΩ minimises conduction losses
• Rated for operation up to 150 °C for high-temperature durability

Applications


• Suitable for body electronics switching tasks in vehicles
• Ideal for multiplexed low-side load distribution systems
• Used for lamp and actuator control requiring multiple outputs
• Can be used for gateway or module integration with SPI control
• Used with surface-mount module assemblies on automotive boards

How is communication with the device achieved?


It supports both parallel signalling and an SPI bus for control.

What mounting method should be used on assemblies?


Surface-mount placement is specified for PCB integration.

How many pins are available for board routing?


The package provides 36 pins for electrical and mechanical connections.

What thermal range can be expected during operation?


It is specified to operate between −40 °C and 150 °C.

What is the device's steady-state operating current?


The operating current is 0.002 A under standard conditions.

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