STMicroelectronics Demonstration Board Power Management for VNI8200XP for High Side Driver
- RS Stock No.:
- 196-1763
- Mfr. Part No.:
- STEVAL-IFP022V1
- Manufacturer:
- STMicroelectronics
Bulk discount available
Subtotal (1 unit)*
TWD3,359.00
(exc. GST)
TWD3,526.95
(inc. GST)
FREE delivery for orders over NT$1,300.00
Supply shortage
- Plus 3 left, shipping from December 15, 2025
Our current stock is limited and our suppliers are expecting shortages.
Units | Per unit |
|---|---|
| 1 - 4 | TWD3,359.00 |
| 5 + | TWD3,292.00 |
*price indicative
- RS Stock No.:
- 196-1763
- Mfr. Part No.:
- STEVAL-IFP022V1
- Manufacturer:
- STMicroelectronics
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | STMicroelectronics | |
| Power Management Function | Power Management | |
| Product Type | Power Management Development Kit | |
| For Use With | High Side Driver | |
| Kit Classification | Evaluation Board | |
| Featured Device | VNI8200XP | |
| Kit Name | Demonstration Board | |
| Standards/Approvals | RoHS | |
| Select all | ||
|---|---|---|
Brand STMicroelectronics | ||
Power Management Function Power Management | ||
Product Type Power Management Development Kit | ||
For Use With High Side Driver | ||
Kit Classification Evaluation Board | ||
Featured Device VNI8200XP | ||
Kit Name Demonstration Board | ||
Standards/Approvals RoHS | ||
- COO (Country of Origin):
- IT
The STEVAL-IFP022V1 demonstration board is based on VNI8200XP high-side driver. It was developed as an instrument to test device functionality in terms of power management and digital interface. The board’s isolated interface between the IPS and host controller were implemented using high-speed opto-couplers for IPS driving, and low-speed opto-couplers to receive device status information. The connection is achieved through a 30-pin connector.
To provide a user-friendly way to test VNI8200XP device functionality, a GUI interface was developed. To use the GUI it is necessary to connect the STEVAL-IFP022V1 demonstration board to a PC by using a communication board.
Thermal performance is improved thanks to a four-layer structure which makes it possible to design a copper area distributed in all the layers for more effective heat dissipation.