Samtec ERF8 Series Vertical Surface PCB Socket, 50-Contact, 2 Row, 1.27 mm Pitch Solder
- RS Stock No.:
- 224-7967
- Mfr. Part No.:
- ERF8-025-05.0-S-DV-TR
- Manufacturer:
- Samtec
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TWD66,300.00
(exc. GST)
TWD69,615.00
(inc. GST)
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- Shipping from December 25, 2026
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Units | Per unit | Per Reel* | Saving |
|---|---|---|---|
| 375 - 1500 | TWD176.80 | TWD66,300.00 | - |
| 1875 - 9000 | TWD172.40 | TWD64,650.00 | 2% |
| 9375 + | TWD168.90 | TWD63,337.50 | 4% |
*price indicative
- RS Stock No.:
- 224-7967
- Mfr. Part No.:
- ERF8-025-05.0-S-DV-TR
- Manufacturer:
- Samtec
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Number of Contacts | 50 | |
| Product Type | PCB Socket | |
| Number of Rows | 2 | |
| Sub Type | Board-to-Board | |
| Current | 2.2A | |
| Pitch | 1.27mm | |
| Housing Material | LCP | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Vertical | |
| Connector System | Board-to-Board | |
| Stacking Height | 18mm | |
| Voltage | 318V | |
| Series | ERF8 | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 4.5mm | |
| Contact Material | Beryllium Copper | |
| Maximum Operating Temperature | 125°C | |
| Contact Plating | Gold | |
| Standards/Approvals | No | |
| Select all | ||
|---|---|---|
Brand Samtec | ||
Number of Contacts 50 | ||
Product Type PCB Socket | ||
Number of Rows 2 | ||
Sub Type Board-to-Board | ||
Current 2.2A | ||
Pitch 1.27mm | ||
Housing Material LCP | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Vertical | ||
Connector System Board-to-Board | ||
Stacking Height 18mm | ||
Voltage 318V | ||
Series ERF8 | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 4.5mm | ||
Contact Material Beryllium Copper | ||
Maximum Operating Temperature 125°C | ||
Contact Plating Gold | ||
Standards/Approvals No | ||
The Samtec ERF8-S is 0.80 mm edge rate rugged high speed socket and a shielded board-mount socket designed for use in high-speed systems. The ERF8-S uses the edge rate and 50 number of position contact system which is designed for applications requiring high-mating cycles and 56Gbps PAM4 performance. The ERF8-S mates with ERM8-S board-mounted headers.
360º metal shielding for reduced EMI
Available with extended guide post
56 Gbps PAM4 performance
Rugged Edge Rate contacts optimized for signal integrity performance
1.5 mm contact wipe
Positions: 20 - 60
Stack Height: 7, 9, 12 and 16 mm
Related links
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- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder