Samtec ASP Series Straight Surface PCB Socket, 160-Contact, 2 Row, 0.5 mm Pitch Solder
- RS Stock No.:
- 180-4691
- Mfr. Part No.:
- ASP-122953-01
- Manufacturer:
- Samtec
The image is for reference only, please refer to product details and specifications
Currently unavailable
We don't know if this item will be back in stock, RS intend to remove it from our range soon.
- RS Stock No.:
- 180-4691
- Mfr. Part No.:
- ASP-122953-01
- Manufacturer:
- Samtec
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Product Type | PCB Socket | |
| Number of Contacts | 160 | |
| Number of Rows | 2 | |
| Sub Type | Terminal Assembly | |
| Current | 2.7A | |
| Pitch | 0.5mm | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Connector System | Board-to-Board | |
| Stacking Height | 10mm | |
| Voltage | 339V | |
| Series | ASP | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 6.18mm | |
| Contact Plating | Gold over Nickel | |
| Maximum Operating Temperature | 125°C | |
| Contact Material | Bronze | |
| Contact Gender | Female | |
| Standards/Approvals | RoHS | |
| Select all | ||
|---|---|---|
Brand Samtec | ||
Product Type PCB Socket | ||
Number of Contacts 160 | ||
Number of Rows 2 | ||
Sub Type Terminal Assembly | ||
Current 2.7A | ||
Pitch 0.5mm | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Straight | ||
Connector System Board-to-Board | ||
Stacking Height 10mm | ||
Voltage 339V | ||
Series ASP | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 6.18mm | ||
Contact Plating Gold over Nickel | ||
Maximum Operating Temperature 125°C | ||
Contact Material Bronze | ||
Contact Gender Female | ||
Standards/Approvals RoHS | ||
- COO (Country of Origin):
- CR
Altera® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in today’s FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.
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