Molex Micro-Fit 3.0 Series Straight Through Hole PCB Header, 2 Contact(s), 3 mm Pitch, 1 Row, Shrouded
- RS Stock No.:
- 233-2933
- Distrelec Article No.:
- 304-28-468
- Mfr. Part No.:
- 43045-0200
- Manufacturer:
- Molex
The image is for reference only, please refer to product details and specifications
Bulk discount available
View bulk pricing optionsSubtotal (1 pack of 5 units)*
TWD132.00
(exc. GST)
TWD138.60
(inc. GST)
FREE delivery for orders over NT$1,300.00
In Stock
- 1,025 unit(s) ready to ship from another location
- Plus 960 unit(s) shipping from July 24, 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Pack* |
|---|---|---|
| 5 - 120 | TWD26.40 | TWD132.00 |
| 125 + | TWD25.20 | TWD126.00 |
*price indicative
- RS Stock No.:
- 233-2933
- Distrelec Article No.:
- 304-28-468
- Mfr. Part No.:
- 43045-0200
- Manufacturer:
- Molex
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Series | Micro-Fit 3.0 | |
| Product Type | PCB Header | |
| Current | 5.0 | |
| Pitch | 3mm | |
| Housing Material | Thermoplastic | |
| Number of Contacts | 2 | |
| Number of Rows | 1 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Material | Brass | |
| Contact Plating | Tin | |
| Row Pitch | 3mm | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 105°C | |
| Contact Gender | Female | |
| Standards/Approvals | No | |
| Mating Pin Length | 3mm | |
| Voltage | 250.0 | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Series Micro-Fit 3.0 | ||
Product Type PCB Header | ||
Current 5.0 | ||
Pitch 3mm | ||
Housing Material Thermoplastic | ||
Number of Contacts 2 | ||
Number of Rows 1 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Material Brass | ||
Contact Plating Tin | ||
Row Pitch 3mm | ||
Minimum Operating Temperature -40°C | ||
Termination Type Solder | ||
Maximum Operating Temperature 105°C | ||
Contact Gender Female | ||
Standards/Approvals No | ||
Mating Pin Length 3mm | ||
Voltage 250.0 | ||
Molex PCB Header, Tin-Plated Brass Contacts, 3mm Pitch - MicroFit 3.0 Series - 43045-0200
Say hello to streamlined circuits with this PCB header from Molex. It lets you make multiple wire-to-board connections onto a single block. A snap-in plastic peg lock and through-hole mounting make assembly a piece of cake while ensuring the header remains firmly in place during operation. As the unit's fully shrouded, the pins are protected from accidental damage, so will last the duration.
Features & Benefits
• Performs reliably in extreme temperatures between -40°C and +105°C
• Lightweight construction tips the scales at 0.542g, so puts little strain on your PCB
• Tin plating resists corrosion and boosts electrical conductivity
Applications
• Audio systems
• Networking equipment
• Automotive manufacturing
How many mating cycles does this PCB header handle?
The header withstands up to 30 mating cycles. This means you can plug and unplug it from corresponding connectors multiple times without damaging it.
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs
Features and Benefits
• High current carrying capacity in a small footprint
• High temperature housings for IR reflow soldering
• Through hole versions SMT compatible
• Positive latching for secure mating connection
• Fully isolated dual beam terminals for reliable electrical performance and contact
• Plastic peg PCB locks for secure connection to PCB
• Glow Wire Compliant
Product Application Information
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals
Molex Micro-Fit 3.0 Series
Related links
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- Molex 43045 Series Right Angle Through Hole Header 3 mm Pitch Shrouded
- Molex 43045 Series Straight Surface Mount PCB Header 3.00 mm Pitch Shrouded
- Molex 43045 Series Vertical Through Hole PCB Header 3 mm Pitch Shrouded
- Molex 43045 Series Vertical Through Hole PCB Header 3 mm Pitch Shrouded