Amphenol ICC 98464 Series Right Angle Through Hole PCB Header, 10 Contact(s), 2 mm Pitch, 2 Row, Shrouded
- RS Stock No.:
- 799-064
- Mfr. Part No.:
- 98464-G61-10ULF
- Manufacturer:
- Amphenol ICC
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Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 799-064
- Mfr. Part No.:
- 98464-G61-10ULF
- Manufacturer:
- Amphenol ICC
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Amphenol ICC | |
| Product Type | PCB Header | |
| Series | 98464 | |
| Current | 2A | |
| Pitch | 2mm | |
| Housing Material | Thermoplastic | |
| Number of Contacts | 10 | |
| Number of Rows | 2 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Board-to-Board, Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Gold or Tin over Nickel | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Through Hole | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | UL94V-0 | |
| Voltage | 650V | |
| Select all | ||
|---|---|---|
Brand Amphenol ICC | ||
Product Type PCB Header | ||
Series 98464 | ||
Current 2A | ||
Pitch 2mm | ||
Housing Material Thermoplastic | ||
Number of Contacts 10 | ||
Number of Rows 2 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Board-to-Board, Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Material Phosphor Bronze | ||
Contact Plating Gold or Tin over Nickel | ||
Minimum Operating Temperature -40°C | ||
Termination Type Through Hole | ||
Contact Gender Male | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals UL94V-0 | ||
Voltage 650V | ||
- COO (Country of Origin):
- FR
The Amphenol ICC Minitek header is an Advanced connector is designed for Pin-in-Paste processes, ensuring reliable soldering for both board-to-board and wire-to-board applications while supporting high mechanical strength essential for various industrial settings.
Compatible with IR reflow soldering processes for efficient assembly
Insulation resistance rating of 1000ΩM minimum for enhanced reliability
Available in a variety of pin configurations, optimising compatibility with diverse applications
Moulded in high temperature thermoplastic, ensuring durability at elevated temperatures
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