Molex 203564 Series Vertical Surface PCB Header, 40 Contact(s), 1 mm Pitch, 2 Row, Shrouded
- RS Stock No.:
- 798-919
- Mfr. Part No.:
- 203564-4017
- Manufacturer:
- Molex
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The image is for reference only, please refer to product details and specifications
Subtotal (1 reel of 1100 units)*
TWD172,344.00
(exc. GST)
TWD180,961.20
(inc. GST)
FREE delivery for orders over NT$1,300.00
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- Shipping from November 23, 2026
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Reel(s) | Per Reel | Per unit* |
|---|---|---|
| 1 + | TWD172,344.00 | TWD156.676 |
*price indicative
- RS Stock No.:
- 798-919
- Mfr. Part No.:
- 203564-4017
- Manufacturer:
- Molex
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Series | 203564 | |
| Product Type | PCB Header | |
| Pitch | 1mm | |
| Number of Contacts | 40 | |
| Housing Material | Polyamide | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Connector System | Wire-to-Board | |
| Contact Material | Bronze | |
| Contact Plating | Gold | |
| Termination Type | Surface Mount | |
| Row Pitch | 1mm | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Voltage | 100V | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Series 203564 | ||
Product Type PCB Header | ||
Pitch 1mm | ||
Number of Contacts 40 | ||
Housing Material Polyamide | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Connector System Wire-to-Board | ||
Contact Material Bronze | ||
Contact Plating Gold | ||
Termination Type Surface Mount | ||
Row Pitch 1mm | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Voltage 100V | ||
- COO (Country of Origin):
- MY
The Molex PCB Header is designed for efficient connectivity in electronic applications, featuring a dual-row layout and a secure surface mount configuration.
1.00mm pitch design ensures Compact integration within electronic devices
Dual row configuration allows for higher circuit density
Surface mount style facilitates easy PCB assembly
0.38μm gold plating enhances conductivity and durability
Includes an inner positive lock mechanism for secure connections
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