Molex 171974 Series Right Angle Through Hole PCB Header, 4 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS Stock No.:
- 788-083
- Mfr. Part No.:
- 171974-0104
- Manufacturer:
- Molex
N
Currently unavailable
We don't know if this item will be back in stock, RS intend to remove it from our range soon.
- RS Stock No.:
- 788-083
- Mfr. Part No.:
- 171974-0104
- Manufacturer:
- Molex
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Product Type | PCB Header | |
| Series | 171974 | |
| Current | 3A | |
| Pitch | 2.54mm | |
| Number of Contacts | 4 | |
| Housing Material | Polymer | |
| Number of Rows | 1 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Material | Brass | |
| Contact Plating | Tin | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Through Hole | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | UL | |
| Voltage | 250V | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Product Type PCB Header | ||
Series 171974 | ||
Current 3A | ||
Pitch 2.54mm | ||
Number of Contacts 4 | ||
Housing Material Polymer | ||
Number of Rows 1 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Material Brass | ||
Contact Plating Tin | ||
Minimum Operating Temperature -40°C | ||
Termination Type Through Hole | ||
Contact Gender Male | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals UL | ||
Voltage 250V | ||
- COO (Country of Origin):
- MY
The Molex PCB header is designed to provide reliable and efficient electrical connections across various applications, optimising performance and durability in demanding environments.
Robust design ensures exceptional reliability in challenging conditions
Facilitates seamless integration with a wide range of existing systems
Offers versatility for various connectivity configurations
Enhances performance with high-speed data transmission capabilities
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