Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter, SOP to DIP
- RS Stock No.:
- 741-9442
- Mfr. Part No.:
- W9521RC
- Manufacturer:
- Winslow
The image is for reference only, please refer to product details and specifications
Bulk discount available
Subtotal (1 unit)*
TWD1,602.00
(exc. GST)
TWD1,682.10
(inc. GST)
FREE delivery for orders over NT$1,300.00
In Stock
- Plus 9 unit(s) shipping from February 16, 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 - 24 | TWD1,602.00 |
| 25 - 99 | TWD1,538.00 |
| 100 + | TWD1,473.00 |
*price indicative
- RS Stock No.:
- 741-9442
- Mfr. Part No.:
- W9521RC
- Manufacturer:
- Winslow
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Product Type | IC Socket Adapter | |
| Connection A | SOP | |
| Number of Contacts A | 44 | |
| Connection Gender A | Female | |
| Number of Contacts B | 44 | |
| Connection Gender B | Male | |
| Connection B | DIP | |
| Pitch | 2.54mm | |
| Contact Plating | Tin over Nickel | |
| Mount Type | Through Hole | |
| Orientation | Straight | |
| Standards/Approvals | No | |
| Contact Material | Brass | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Product Type IC Socket Adapter | ||
Connection A SOP | ||
Number of Contacts A 44 | ||
Connection Gender A Female | ||
Number of Contacts B 44 | ||
Connection Gender B Male | ||
Connection B DIP | ||
Pitch 2.54mm | ||
Contact Plating Tin over Nickel | ||
Mount Type Through Hole | ||
Orientation Straight | ||
Standards/Approvals No | ||
Contact Material Brass | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
SOIC to DIP Sockets
Adaptics’ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
PCB: Epoxy Fibreglass FR4
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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