Winslow Straight Through Hole Mount 7.62 mm Pitch IC Socket Adapter, DIP to DIP
- RS Stock No.:
- 158-3039
- Mfr. Part No.:
- W9115RC
- Manufacturer:
- Winslow
The image is for reference only, please refer to product details and specifications
Bulk discount available
Subtotal (1 unit)*
TWD537.00
(exc. GST)
TWD563.85
(inc. GST)
FREE delivery for orders over NT$1,300.00
In Stock
- Plus 27 unit(s) shipping from February 16, 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 - 24 | TWD537.00 |
| 25 - 74 | TWD524.00 |
| 75 - 199 | TWD513.00 |
| 200 - 399 | TWD500.00 |
| 400 + | TWD488.00 |
*price indicative
- RS Stock No.:
- 158-3039
- Mfr. Part No.:
- W9115RC
- Manufacturer:
- Winslow
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Product Type | IC Socket Adapter | |
| Connection A | DIP | |
| Connection Gender A | Female | |
| Connection Gender B | Male | |
| Pitch | 7.62mm | |
| Connection B | DIP | |
| Contact Plating | Gold over Nickel | |
| Mount Type | Through Hole | |
| Orientation | Straight | |
| Standards/Approvals | No | |
| Contact Material | Brass | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Product Type IC Socket Adapter | ||
Connection A DIP | ||
Connection Gender A Female | ||
Connection Gender B Male | ||
Pitch 7.62mm | ||
Connection B DIP | ||
Contact Plating Gold over Nickel | ||
Mount Type Through Hole | ||
Orientation Straight | ||
Standards/Approvals No | ||
Contact Material Brass | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
DIP Expansion & Reduction Sockets
'Adaptics' that convert dual in line packages from one pitch to another pitch.
PCB: Epoxy Fibreglass FR4
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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