Fischer Elektronik Heatsink, Universal Square Alu, 15.7K/W 10 mm 35 mm 35mm
- RS Stock No.:
- 674-4765
- Mfr. Part No.:
- ICK BGA 35x35x10
- Manufacturer:
- Fischer Elektronik
Bulk discount available
View bulk pricing optionsSubtotal (1 unit)*
TWD83.00
(exc. GST)
TWD87.15
(inc. GST)
FREE delivery for orders over NT$1,300.00
In Stock
- Plus 3 unit(s) shipping from October 26, 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 - 49 | TWD83.00 |
| 50 - 99 | TWD82.00 |
| 100 - 249 | TWD78.00 |
| 250 + | TWD76.00 |
*price indicative
- RS Stock No.:
- 674-4765
- Mfr. Part No.:
- ICK BGA 35x35x10
- Manufacturer:
- Fischer Elektronik
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Fischer Elektronik | |
| Product Type | Heatsink | |
| For Use With | Universal Square Alu | |
| Length | 35mm | |
| Width | 35mm | |
| Height | 10mm | |
| Fastening | Clamp, Glue, Integrated clamp, Screw, Thermally conductive adhesive | |
| Thermal Resistance | 15.7K/W | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | BGA | |
| Standards/Approvals | No | |
| Application | Heat Sink For Power PC, Semiconductor, Technical Introduction, Heatsink for PGA, SMD, Fan, Hole Pattern, Thermal, Heat Sink For 3 II Mobile Module, Heat Sink For IC, Cooler, Heat Sink For Microprocessor, Heat Sink For Bga, Pin Heat Sinks, Heat Sink For Dil/Ic, Processor Overview, Heat Sink For PLCC | |
| Material | Aluminium | |
| Select all | ||
|---|---|---|
Brand Fischer Elektronik | ||
Product Type Heatsink | ||
For Use With Universal Square Alu | ||
Length 35mm | ||
Width 35mm | ||
Height 10mm | ||
Fastening Clamp, Glue, Integrated clamp, Screw, Thermally conductive adhesive | ||
Thermal Resistance 15.7K/W | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type BGA | ||
Standards/Approvals No | ||
Application Heat Sink For Power PC, Semiconductor, Technical Introduction, Heatsink for PGA, SMD, Fan, Hole Pattern, Thermal, Heat Sink For 3 II Mobile Module, Heat Sink For IC, Cooler, Heat Sink For Microprocessor, Heat Sink For Bga, Pin Heat Sinks, Heat Sink For Dil/Ic, Processor Overview, Heat Sink For PLCC | ||
Material Aluminium | ||
- COO (Country of Origin):
- DE
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
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