Fischer Elektronik Heatsink, Universal Square Alu, 14.8K/W 12.3 mm 23 mm 23mm
- RS Stock No.:
- 674-4743
- Mfr. Part No.:
- ICK PGA 8x8x12
- Manufacturer:
- Fischer Elektronik
Bulk discount available
View bulk pricing optionsSubtotal (1 unit)*
TWD71.00
(exc. GST)
TWD74.55
(inc. GST)
FREE delivery for orders over NT$1,300.00
In Stock
- 316 unit(s) ready to ship from another location
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 - 49 | TWD71.00 |
| 50 - 99 | TWD70.00 |
| 100 - 249 | TWD68.00 |
| 250 + | TWD67.00 |
*price indicative
- RS Stock No.:
- 674-4743
- Mfr. Part No.:
- ICK PGA 8x8x12
- Manufacturer:
- Fischer Elektronik
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Fischer Elektronik | |
| Product Type | Heatsink | |
| For Use With | Universal Square Alu | |
| Length | 23mm | |
| Width | 23mm | |
| Height | 12.3mm | |
| Fastening | Integrated clamp, Conductive Adhesive, Screw, Clamp, Thermally conductive adhesive, Glue | |
| Thermal Resistance | 14.8K/W | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | PGA | |
| Standards/Approvals | No | |
| Application | PGA, Pin Heat Sinks, SMD, Fan, Microprocessor, Heat Sink For IC, PLCC, Bga, Cooler, Power PC, Semiconductor, Ic Processors, Thermal | |
| Material | Aluminium | |
| Select all | ||
|---|---|---|
Brand Fischer Elektronik | ||
Product Type Heatsink | ||
For Use With Universal Square Alu | ||
Length 23mm | ||
Width 23mm | ||
Height 12.3mm | ||
Fastening Integrated clamp, Conductive Adhesive, Screw, Clamp, Thermally conductive adhesive, Glue | ||
Thermal Resistance 14.8K/W | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type PGA | ||
Standards/Approvals No | ||
Application PGA, Pin Heat Sinks, SMD, Fan, Microprocessor, Heat Sink For IC, PLCC, Bga, Cooler, Power PC, Semiconductor, Ic Processors, Thermal | ||
Material Aluminium | ||
- COO (Country of Origin):
- DE
ICK PGA Series
Heatsinks for IC processor
Black anodised surface
Mounting by thermally conductive foil or thermally conductive adhesive（Therm.conductive foil or therm.cond. adhesive are not provided for fixation）
PGA Heatsinks
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