RS PRO Heatsink, Universal Rectangular Alu, 2.5kΩ/W 25 mm 50 mm 88mm
- RS Stock No.:
- 234-2508
- Manufacturer:
- RS PRO
Subtotal (1 unit)*
TWD308.00
(exc. GST)
TWD323.40
(inc. GST)
FREE delivery for orders over NT$1,300.00
In Stock
- 149 unit(s) ready to ship from another location
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 + | TWD308.00 |
*price indicative
- RS Stock No.:
- 234-2508
- Manufacturer:
- RS PRO
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | RS PRO | |
| Product Type | Heatsink | |
| For Use With | Universal Rectangular Alu | |
| Length | 50mm | |
| Width | 88mm | |
| Height | 25mm | |
| Thermal Resistance | 2.5kΩ/W | |
| Fastening | Screw | |
| Colour | Black | |
| Finish | Black Anodised | |
| Standards/Approvals | RoHS | |
| Material | Aluminium | |
| Application | High Power Semiconductor Device, Optoelectronic Device | |
| Select all | ||
|---|---|---|
Brand RS PRO | ||
Product Type Heatsink | ||
For Use With Universal Rectangular Alu | ||
Length 50mm | ||
Width 88mm | ||
Height 25mm | ||
Thermal Resistance 2.5kΩ/W | ||
Fastening Screw | ||
Colour Black | ||
Finish Black Anodised | ||
Standards/Approvals RoHS | ||
Material Aluminium | ||
Application High Power Semiconductor Device, Optoelectronic Device | ||
- COO (Country of Origin):
- GB
Low Profile Non-standard Extrusion With Channel
ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.
Note
Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Pre-drilled to take 1 off TO3 metal can semiconuctor package.
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