Transcend M.2 256 MB Internal SSD

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TWD11,110.00

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TWD11,665.50

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RS Stock No.:
683-086
Mfr. Part No.:
TS256GMTS970TI-VS1
Manufacturer:
Transcend
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Brand

Transcend

Product Type

SSD

Memory Size

256MB

Sub Type

SSD

Internal/External

Internal

Industrial Grade

Yes

Form Factor

M.2

NAND Type

3D

Interface Type

SATA III 6 Gb/S

Maximum Operating Temperature

85°C

Minimum Operating Temperature

-40°C

Height

3.58mm

Length

80mm

Standards/Approvals

UKCA

Width

22mm

Transcend SSD, 256MB Memory size, M.2 Form Factor - TS256GMTS970TI-VS1


This solid-state drive provides compact, high-performance storage for embedded and industrial environments. Designed for internal use, it connects via an M.2 Interface using the SATA III 6Gb/s protocol and is intended for applications that require a slim, Durable storage module capable of operating across a wide temperature range.

Features and Benefits:


• 256GB capacity delivers substantial storage for datasets
• 3D NAND flash enhances endurance for continuous operation
• Industrial-grade construction supports harsh system demands
• UKCA certified for regional regulatory acceptance
• Wide operating range from -40 to 85°C enables high-temperature deployment
• Low-profile 3.58mm height fits confined hardware spaces

Applications


• Suitable for automation controllers on factory floors
• Ideal for data logging in harsh environmental monitoring
• Used with embedded computing platforms in transport systems
• Can be used for firmware storage in electrical control cabinets
• Used for ruggedised HMI terminals in mechanical systems

Which physical form factor should I plan for on my board?


The module uses the M.2 form factor and measures 80mm in length with a 22mm width profile, matching M.2 2280 footprints for PCB layout and connector placement.

How does the Interface affect data throughput in designs?


It employs a SATA III 6Gb/s link, which sets the maximum serial bus bandwidth for sustained transfers and informs bus arbitration and buffering strategies.

What memory architecture is used for flash management?


The device uses vertically stacked 3D NAND cells, affecting wear-level algorithms and write-amplification characteristics in system-level storage management.

Is this suitable for internal installation in sealed enclosures?


Yes, it is intended as an internal storage component and is appropriate for enclosed systems where a compact, mounted module is required.

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