Infineon 1ED3124MU12FXUMA1, Isolated Gate Driver 2, 13.5 A 8-Pin 17V, DSO
- RS Stock No.:
- 228-6504
- Mfr. Part No.:
- 1ED3124MU12FXUMA1
- Manufacturer:
- Infineon
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- RS Stock No.:
- 228-6504
- Mfr. Part No.:
- 1ED3124MU12FXUMA1
- Manufacturer:
- Infineon
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | Gate Driver | |
| Output Current | 13.5A | |
| Pin Count | 8 | |
| Package Type | DSO | |
| Fall Time | 30ns | |
| Number of Outputs | 2 | |
| Driver Type | Isolated Gate Driver | |
| Rise Time | 30ns | |
| Minimum Supply Voltage | 3.1V | |
| Maximum Supply Voltage | 17V | |
| Number of Drivers | 2 | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 125°C | |
| Series | 1ED3124MU12F | |
| Width | 3.9mm | |
| Standards/Approvals | No | |
| Length | 4.9mm | |
| Height | 1.75mm | |
| Mount Type | Surface | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type Gate Driver | ||
Output Current 13.5A | ||
Pin Count 8 | ||
Package Type DSO | ||
Fall Time 30ns | ||
Number of Outputs 2 | ||
Driver Type Isolated Gate Driver | ||
Rise Time 30ns | ||
Minimum Supply Voltage 3.1V | ||
Maximum Supply Voltage 17V | ||
Number of Drivers 2 | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 125°C | ||
Series 1ED3124MU12F | ||
Width 3.9mm | ||
Standards/Approvals No | ||
Length 4.9mm | ||
Height 1.75mm | ||
Mount Type Surface | ||
Automotive Standard No | ||
Infineon 1ED3124MU12F Series Gate Driver, 3.1V Minimum Supply Voltage, 13.5A Output Current - 1ED3124MU12FXUMA1
Features and Benefits:
• 13.5A output current supports Rapid gate charging for Faster switching
• Operating range from 3.1V to 17V allows low-voltage to mid-voltage supply use
• Symmetrical 30ns rise and fall times reduce switching transition durations
• Isolation-type driver reduces ground-loop interactions between circuits
Applications
• Ideal for dual-switch inverter legs in motor-control modules
• Used with isolated half-bridge stages in power-supply designs
• Can be used for gate control in high-density power assembly layouts
How many independent gate channels does it provide?
What package and pin count are used for PCB integration?
What temperature range can it tolerate during operation?
What physical footprint should designers expect when planning board space?
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