Trenz Electronic GmbH TE0720-04-61Q33MA Zynq Ultrascale+ MPSoC Development Board Module AMD Automotive Zynq 7020 for
- RS Stock No.:
- 907-760
- Mfr. Part No.:
- TE0720-04-61Q33MA
- Manufacturer:
- Trenz Electronic GmbH
N
Subtotal (1 unit)*
TWD11,388.00
(exc. GST)
TWD11,957.40
(inc. GST)
FREE delivery for orders over NT$1,300.00
Temporarily out of stock
- Shipping from December 13, 2027
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 + | TWD11,388.00 |
*price indicative
- RS Stock No.:
- 907-760
- Mfr. Part No.:
- TE0720-04-61Q33MA
- Manufacturer:
- Trenz Electronic GmbH
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Trenz Electronic GmbH | |
| Kit Classification | Module | |
| Programmable Logic Technology | FPGA | |
| Product Type | SoC | |
| For Use With | Trenz Electronic 4 x 5 cm baseboards | |
| Featured Device | AMD Automotive Zynq 7020 | |
| Kit Name | Zynq Ultrascale+ MPSoC Development Board | |
| Standards/Approvals | RoHS Compliant | |
| Select all | ||
|---|---|---|
Brand Trenz Electronic GmbH | ||
Kit Classification Module | ||
Programmable Logic Technology FPGA | ||
Product Type SoC | ||
For Use With Trenz Electronic 4 x 5 cm baseboards | ||
Featured Device AMD Automotive Zynq 7020 | ||
Kit Name Zynq Ultrascale+ MPSoC Development Board | ||
Standards/Approvals RoHS Compliant | ||
- COO (Country of Origin):
- DE
The Trenz Electronic GmbH Industrial-grade System on Module (SoM) designed for high-performance applications, featuring robust connectivity and processing capability using Advanced semiconductor technology.
Combines AMD Zynq-7000 SoC with up to 1 GByte DDR3 SDRAM for efficient processing
Equipped with Gigabit Ethernet and USB PHY transceivers for versatile connectivity
Includes a Power Supervisor with Watchdog Timer to enhance system reliability
Supports various I/O configurations via high-speed stacking connections
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