Trenz Electronic GmbH AM0010-02-3BI21MA ULTRASOM+MPSOC Module Module AMD Zynq UltraScale ZU3EG for Andromeda carrier
- RS Stock No.:
- 907-752
- Mfr. Part No.:
- AM0010-02-3BI21MA
- Manufacturer:
- Trenz Electronic GmbH
N
Subtotal (1 unit)*
TWD35,911.00
(exc. GST)
TWD37,706.55
(inc. GST)
FREE delivery for orders over NT$1,300.00
Temporarily out of stock
- Shipping from December 13, 2027
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 + | TWD35,911.00 |
*price indicative
- RS Stock No.:
- 907-752
- Mfr. Part No.:
- AM0010-02-3BI21MA
- Manufacturer:
- Trenz Electronic GmbH
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Trenz Electronic GmbH | |
| Product Type | SoC | |
| Programmable Logic Technology | FPGA | |
| Kit Classification | Module | |
| For Use With | Andromeda carrier boards | |
| Featured Device | AMD Zynq UltraScale ZU3EG | |
| Kit Name | ULTRASOM+MPSOC Module | |
| Standards/Approvals | RoHS Compliant | |
| Select all | ||
|---|---|---|
Brand Trenz Electronic GmbH | ||
Product Type SoC | ||
Programmable Logic Technology FPGA | ||
Kit Classification Module | ||
For Use With Andromeda carrier boards | ||
Featured Device AMD Zynq UltraScale ZU3EG | ||
Kit Name ULTRASOM+MPSOC Module | ||
Standards/Approvals RoHS Compliant | ||
- COO (Country of Origin):
- DE
The Trenz Electronic GmbH Module offers an industrial-grade solution based on AMD Xilinx technology, designed for Advanced applications requiring robust performance and high reliability in embedded systems.
Supports SoC devices ranging from ZU1 to ZU5 for flexible development options
Delivers essential interfaces including Gigabit Ethernet and USB for seamless connectivity
Features up to 32 GB of RAM and various Storage Options including eMMC and HyperFlash
Includes multiple on-board peripherals for enhanced functionality and ease of integration
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