Infineon IGBT 1200 V
- RS Stock No.:
- 253-9834
- Mfr. Part No.:
- FP50R12N2T7PBPSA1
- Manufacturer:
- Infineon
The image is for reference only, please refer to product details and specifications
Bulk discount available
Subtotal (1 tray of 10 units)*
TWD24,717.00
(exc. GST)
TWD25,952.80
(inc. GST)
Stock information currently inaccessible - Please check back later
Units | Per unit | Per Tray* |
|---|---|---|
| 10 - 10 | TWD2,471.70 | TWD24,717.00 |
| 20 + | TWD2,372.80 | TWD23,728.00 |
*price indicative
- RS Stock No.:
- 253-9834
- Mfr. Part No.:
- FP50R12N2T7PBPSA1
- Manufacturer:
- Infineon
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | IGBT | |
| Maximum Collector Emitter Voltage Vceo | 1200V | |
| Maximum Power Dissipation Pd | 20mW | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Collector Emitter Saturation Voltage VceSAT | 1.8V | |
| Maximum Operating Temperature | 175°C | |
| Length | 107.5mm | |
| Standards/Approvals | RoHS | |
| Height | 17mm | |
| Series | FP50R12N2T7PB | |
| Width | 45 mm | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type IGBT | ||
Maximum Collector Emitter Voltage Vceo 1200V | ||
Maximum Power Dissipation Pd 20mW | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Minimum Operating Temperature -40°C | ||
Maximum Collector Emitter Saturation Voltage VceSAT 1.8V | ||
Maximum Operating Temperature 175°C | ||
Length 107.5mm | ||
Standards/Approvals RoHS | ||
Height 17mm | ||
Series FP50R12N2T7PB | ||
Width 45 mm | ||
Automotive Standard No | ||
The Infineon FP50 series is a EconoPIM 2 module with IGBT7 and emitter controlled diode and NTC or pre-applied thermal interface material.
Overload operation up to 175°C
High power and thermal cycling capability
Integrated NTC temperature sensor
Copper base plate
Pre-applied thermal interface material
Solder contact technology