Bergquist Heatsink Adhesive Tape for use with Heatsink
- RS Stock No.:
- 477-4840
- Mfr. Part No.:
- BP100-0.005-00-1112
- Manufacturer:
- Bergquist
16 In stock for delivery within 6 working days
Added
Price (VAT excluded) Each
TWD1,477.00
(exc. GST)
TWD1,550.85
(inc. GST)
| Units | Per unit |
| 1 + | TWD1,477.00 |
- RS Stock No.:
- 477-4840
- Mfr. Part No.:
- BP100-0.005-00-1112
- Manufacturer:
- Bergquist
Product overview and Technical data sheets
Legislation and Compliance
- COO (Country of Origin):
- US
Product Details
Bond-Ply 100
Bond-Ply 100 is thermally conductive, double-sided pressure sensitive adhesive tape. It is designed to attain high bond strength with long term exposure to moderate heat and high humidity. Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting. Available in four different sizes.
Uses include:
Mounting heatsink to BGA graphic processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
Mounting heatsink onto computer processor
Mounting heatsink onto drive processor
Note
Stock Number 477-4856 dimensions 150 x 150 x 0.127 mm
Stock Number 477-4862 dimensions 50 x 50 x 0.127 mm
Stock Number 4774878 dimenssions 250x 25 x 0.127 mm
Stock Number 477-4862 dimensions 50 x 50 x 0.127 mm
Stock Number 4774878 dimenssions 250x 25 x 0.127 mm
Specifications
Attribute | Value |
|---|---|
| Accessory Type | Adhesive Tape |
| For Use With | Heatsink |