TE Connectivity 2.54mm Pitch Vertical 32 Way, Through Hole Stamped Pin Closed Frame IC Dip Socket
- RS Stock No.:
- 164-4079
- Mfr. Part No.:
- 2-382189-1
- Manufacturer:
- TE Connectivity
The image is for reference only, please refer to product details and specifications
Discontinued product
- RS Stock No.:
- 164-4079
- Mfr. Part No.:
- 2-382189-1
- Manufacturer:
- TE Connectivity
Product overview and Technical data sheets
Legislation and Compliance
- COO (Country of Origin):
- US
Product Details
TE Connectivity DIPLOMATE Dual Leaf PCB Mount DIP Socket
DIPLOMATE Dual Leaf (DL) DIP sockets with stamped and formed dual wiping contacts for vertical, through hole PCB mounting. These DIPLOMATE Dual Leaf (DL) DIP sockets have black thermoplastic GF stackable housings with a 2.54mm centreline, and a "true closed bottom" design which prevents solder or flux wicking and standoffs to allow board clearance for cleaning after soldering. The profiles for these DIPLOMATE Dual Leaf (DL) DIP sockets are all standard apart from part number 719-8817 which has an over-the-component profile. These DIPLOMATE DIP sockets are available with different frame styles with either straight or retention legs.
For products that are Customized and under Non-cancellable & Non-returnable, Sales & Conditions apply.
Specifications
Attribute | Value |
|---|---|
| Number of Contacts | 32 |
| Mounting Type | Through Hole |
| Pin Type | Stamped |
| Pitch | 2.54mm |
| Row Width | 15.24mm |
| Frame Type | Closed Frame |
| Termination Method | Solder |
| Contact Plating | Tin |
| Orientation | Vertical |
| Length | 40.51mm |
| Width | 5.33mm |
| Depth | 17.63mm |
| Dimensions | 40.51 x 5.33 x 17.63mm |
| Contact Material | Beryllium Copper |
| Maximum Operating Temperature | +105°C |
| Minimum Operating Temperature | -55°C |
| Housing Material | Thermoplastic |