TE Connectivity Z-PACK HM-Zd Series 2.5mm Pitch 2 Pair, High Speed Hard Metric Backplane Connector, Straight, 10 Column

Product overview and Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
Product Details

TE Connectivity Z-PACK™ HM-Zd Headers and Connector Assemblies

Z-PACK™ HM-Zd headers and connector assemblies with a 2.50mm centerline. These Z-PACK™ HM-Zd Pin headers and receptacle connector assemblies are press fit PCB through hole mounting and have polyester GF housings.

HM-Zd is the backplane interconnect for PICMG 3.x (ATCA) industry standard
High speed, differential, board to backplane electrical connectors
Provides a differential solution for applications in the range 3 to 6.4 Gb/s
Extension of IEC61076-4-101

Standards

PICMG

The Z-PACK 2 mm HM Interconnection System is designed as a two part system for the connection of free boards (Daughterboards or PCBs) to fixed boards (Motherboards, Backplane or Backpanel) and feed the connection through the fixed board.

Specifications
Attribute Value
Backplane Connector Type High Speed Hard Metric, 2 Pair
Number of Contacts 40
Number of Columns 10
Number of Rows 4
Body Orientation Straight
Housing Material PE
Pitch 2.5mm
Contact Material Phosphor Bronze
Mounting Type Through Hole
Contact Plating Gold over Nickel
Current Rating 700mA
Voltage Rating 250 V ac
Termination Method Press-In
Series Z-PACK HM-Zd
Minimum Operating Temperature -65°C
Maximum Operating Temperature +105°C
14 In stock for delivery within 6 working days
Price (VAT excluded) Each
TWD 368.00
(exc. GST)
TWD 386.00
(inc. GST)
units
Per unit
1 - 19
TWD368.00
20 - 74
TWD354.00
75 - 299
TWD346.00
300 - 599
TWD341.00
600 +
TWD337.00
Packaging Options: