Press Releases

RS Components Supports Rapid Prototyping with Availability of New mbed Application Board

New mbed application board packs in an abundance of connectivity and sensing options for virtually unlimited range of engineering projects

Taiwan, 26 February 2013 :

RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the world's leading high service distributor of electronics and maintenance products, has announced the availability of a new mbed application board.

Based around the mbed developer platform, the new mbed application board includes a host of connectors and external interfaces, eliminating the requirement for add-on boards and thus reducing valuable design time for engineers.

The new application board is credit-card sized (54mm x 86mm) and is specifically designed for use with the mbed NXP LPC1768 microcontroller module. Providing multi-functional capability, the new board enables the maximum number of potential experiments and projects, while retaining board footprint at a minimum. 

The mbed application board offers an impressive array of features including a 128 x 32 graphics LCD; a 3-axis accelerometer; temperature sensor; servo-motor headers; PWM controlled LEDs; socket for ZigBee, Wi-Fi and Bluetooth wireless connectivity; Ethernet and USB connectors; and a speaker and I/O audio jacks.

"This new application board is an important addition to the mbed family that allows engineers to experience ARM® technology-based programming," said Mark Cundle, Head of Technical Marketing, RS Components. "Designed specifically for use with the mbed NXP LPC1768, the module saves engineers significant time in project development, and the huge range of connectivity options brings a huge range of 'Internet-of-Things' (IoT) applications into play."

Please click mbed application board for more information, and to purchase the from RS stock.